Flexible Film Substrate Detachment via Tensile Force and Solvent
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Solution Overview
Problem
The semiconductor industry faces challenges in non-destructively detaching thin product substrates from carrier substrates due to breakage and damage during the detachment process, especially as substrates become thinner and lack dimensional stability, requiring gentle and effective methods to avoid curling and ensure handling stability.
Innovation Solution
A method utilizing a flexible film mounted on a film frame to apply tensile force to the product substrate, starting from the edge, with options for adhesive layers, solvent dissolution, and mechanical separation, including the use of UV light and sound waves to facilitate detachment while protecting the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional detachment methods are used, then detachment can be achieved, but the thin product substrates easily break or are damaged during the process
Solution Approach 1:
A flexible film is introduced as an intermediary element between the product substrate and the detachment mechanism. The film is selectively adhered to the substrate and used to gently lift and detach the substrate from the carrier without direct mechanical contact that could cause damage. This mediator allows force application while protecting the fragile substrate.
Solution Approach 2:
The invention employs a flexible film that can conform to the substrate surface and apply distributed gentle forces during detachment. The film's flexibility allows it to adapt to substrate curvature and apply tensile forces evenly, preventing localized stress concentrations that would cause breakage in conventional rigid detachment methods.
2Ease of operation
If thin product substrates are handled without support, then they can be freely manipulated, but they curl up due to lack of dimensional stability
Solution Approach 1:
The flexible film serves as a temporary support structure that maintains the substrate's dimensional stability during handling and processing. The film's flexibility allows the substrate to be manipulated freely while the film prevents curling by providing continuous support across the substrate surface.
Solution Approach 2:
The flexible film is selectively adhered only to specific regions of the substrate (typically the back surface), leaving the front surface exposed for subsequent processing. This segmented adhesion approach provides support where needed while maintaining accessibility for further manufacturing steps.
3Strength
If the adhesive layer covers the entire substrate surface, then strong bonding is achieved, but the detachment force required increases and may damage the substrate
Solution Approach 1:
The adhesive layer is applied selectively only to the back surface of the substrate rather than the entire surface. This localized adhesion provides sufficient bonding strength to hold the substrate during processing while reducing the total adhesive force that must be overcome during detachment, thereby reducing the risk of substrate damage.
Solution Approach 2:
Instead of applying adhesive over the entire substrate surface, the invention uses partial coverage limited to the back surface. This partial action achieves the necessary bonding strength for handling while avoiding excessive total adhesion that would require damaging forces to overcome during detachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables gentle and efficient detachment of thin product substrates from carrier substrates, minimizing damage and allowing immediate use post-separation, with the flexible film providing protection and enabling further process steps directly on the film frame.
Implementation Method 1
using the elasticity or flexibility of a film mounted on a film frame in order to detach the product substrate gently and from the edge of the product substrate, namely by deforming the film
Implementation Method 2
the use of UV light, laser beams, the action of temperature or solvents
Implementation Method 3
acoustic waves by deformation of a flexible film mounted on a frame
Data Source
Figure 1a~1b
Figure 2~3
Figure 4
AI summary
The device is provided with a film with an adhesive layer (3s) to accommodate the product substrate in a contacting surface section (3k) of the film. The film is mounted in a mounting section (3b) encasing the contacting surface section. A separating section (3a) is placed between the contacting surface section and the mounting section. An independent claim is also included for a method for separating a product substrate from a carrier substrate.