Flexible Glass Optical Waveguide for High-Temperature PCB Processing

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Solution Overview

Problem

Current flexible optical waveguides, particularly those based on polymers, are not suitable for high-temperature processes, limiting their application in optical interconnects for systems like printed circuit boards.

Innovation Solution

A flexible glass optical waveguide structure with a substrate thickness of no more than 0.3 mm, capable of supporting temperatures greater than 250 °C, is developed, incorporating waveguide features formed of glass material that can transmit optical signals and integrate electrical devices, allowing for high-temperature PCB processing while maintaining flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If polymer-based flexible optical waveguides are used, then flexibility is achieved, but high-temperature processing capability is lost

Engineering Contradiction:
ImproveflexibilityVSAvoidhigh-temperature processing capability
Core Design Contradiction:
Ease of operationVSTemperature

Solution Approach 1:

The patent employs a composite structure consisting of a flexible glass substrate (providing high-temperature capability) combined with polymer cladding layers (providing optical confinement and flexibility). This composite approach allows the waveguide to simultaneously achieve thermal stability for PCB processing and mechanical flexibility for interconnect applications.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the fundamental material parameter from polymer to glass for the substrate, which fundamentally alters the thermal properties while maintaining flexibility through thin-film architecture and appropriate glass composition selection, enabling operation at temperatures exceeding 250°C.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If glass substrate is used instead of polymer, then high-temperature processing capability is achieved, but flexibility may be compromised

Engineering Contradiction:
Improvehigh-temperature processing capabilityVSAvoidflexibility
Core Design Contradiction:
TemperatureVSEase of operation

Solution Approach 1:

The patent utilizes an ultra-thin glass substrate architecture where the reduced thickness (compared to conventional glass) provides sufficient flexibility while maintaining the inherent high-temperature stability of glass material. The thin-film structure allows the rigid glass to bend without fracturing, reconciling thermal stability with mechanical flexibility.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The flexible glass optical waveguide structure enables efficient optical signal transmission and supports high-temperature processing, facilitating the integration of optical and electrical components, thus addressing the limitations of polymer-based waveguides in high-temperature applications.

Implementation Method 1

a flexible glass optical waveguide structure (10) having a flexible glass substrate (12) and a waveguide feature (16) carried by the flexible glass substrate (12) and transmitting optical signals through the flexible glass optical waveguide structure (10)

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentEP3060950B1Flexible glass optical waveguide structures
Publication Date: 2020.08.26 CORNING INC
  • EP3060950B1 patent drawingFigure 1
  • EP3060950B1 patent drawingFigure 2~4
  • EP3060950B1 patent drawingFigure 5~7

AI summary

An optical waveguide device includes a flexible glass optical waveguide structure including a flexible glass substrate having a thickness of no greater than about 0.3 mm. The flexible glass substrate has at least one waveguide feature that transmits optical signals through the flexible glass substrate. The at least one waveguide feature is formed of glass material that forms the flexible glass substrate. An electrical device is located on a surface of the flexible glass substrate.