Flexible Graphite Heat Spreader for Thermal Management

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Solution Overview

Problem

Computing devices face challenges in efficiently dissipating heat generated by components like CPUs and batteries, leading to performance throttling and user discomfort due to high temperatures.

Innovation Solution

A flexible, thermally conductive heat spreader is used, composed of materials like graphite, copper, or aluminum, integrated with an electrically insulating layer and adhesive, to dissipate heat from heat-generating elements across a large surface area within the device enclosure, providing both heat dissipation and electrical insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If heat-generating components (CPU, battery) are placed in the device, then device functionality is improved, but device temperature increases causing performance throttling and user discomfort

Engineering Contradiction:
Improvedevice functionalityVSAvoiddevice temperature
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

A flexible heat spreader assembly is introduced as an intermediary component between the heat-generating components (CPU, battery) and the device housing. This assembly includes a thermally conductive graphite layer that conducts heat away from the components, and an electrically insulating layer that provides electrical isolation. The heat spreader transfers heat from the components to the housing in a controlled manner, preventing direct thermal coupling while maintaining device functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat spreader assembly utilizes the flexible, multi-layer structure to distribute heat across multiple dimensions - spreading heat laterally across the graphite layer and transferring it vertically to the housing through the insulating layer. This dimensional approach allows heat to be dispersed over a larger surface area rather than concentrating it at single points.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Loss of energy

If heat is concentrated in specific areas (hot spots), then heat dissipation efficiency is improved, but component reliability decreases due to localized overheating

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidcomponent reliability
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The heat spreader assembly applies local quality by using the thermally conductive graphite layer in direct contact with heat-generating components to efficiently conduct heat away from hot spots. The graphite's high thermal conductivity addresses localized heat concentration, while the flexible nature of the assembly allows it to conform to the specific geometry of different components, ensuring uniform heat distribution across contact surfaces.

Inventive Principle:
Principle #3Local quality

3Loss of energy

If thermally conductive materials are used for heat dissipation, then heat dissipation performance is improved, but electrical insulation is compromised

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidelectrical insulation
Core Design Contradiction:
Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The heat spreader assembly employs composite materials by combining a thermally conductive graphite layer with an electrically insulating layer. The graphite layer provides superior heat dissipation performance with high thermal conductivity, while the insulating layer (such as polyimide or polyester) provides electrical isolation. This composite structure allows the assembly to simultaneously achieve both thermal management and electrical safety requirements.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The assembly merges multiple functions into a single integrated component - thermal conduction, electrical insulation, and mechanical flexibility. Rather than using separate components for each function, the heat spreader combines these properties in a unified flexible assembly that can be directly applied to heat-generating components, simplifying the overall device structure while maintaining performance.

Inventive Principle:
Principle #5Merging (Combining)

4Loss of energy

If rigid heat sinks are used, then heat dissipation capacity is improved, but device flexibility and integration are reduced

Engineering Contradiction:
Improveheat dissipation capacityVSAvoidintegration complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The heat spreader assembly utilizes flexible thin films - specifically a flexible graphite layer and insulating layer - to provide heat dissipation capabilities. This flexible construction allows the heat spreader to conform to the contours of various heat-generating components and be easily integrated into different device configurations without requiring complex mounting structures or rigid assemblies.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heat spreader effectively reduces component temperatures, eliminates hot spots, and improves user comfort by evenly distributing heat, thus enhancing device performance and longevity.

Implementation Method 1

a flexible sheet assembly configured to dissipate heat generated by the heat generating element away from the at least one heat generating element and across a lateral surface of the rear wall of the enclosure

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10551886B1Display with integrated graphite heat spreader and printed circuit board insulator
Publication Date: 2020.02.04 GOOGLE LLC
  • US10551886B1 patent drawing
  • US10551886B1 patent drawing
  • US10551886B1 patent drawing

AI summary

An apparatus is described that includes an enclosure including a first sidewall, a second sidewall aligned parallel to the first sidewall, a front wall, a rear wall aligned parallel to the front wall, and at least one structure disposed between the front wall and the rear wall. The apparatus also includes a heat generating element within the enclosure, the heat generating element being mounted to a first surface of the at least one structure and a flexible sheet assembly configured to dissipate heat generated by the heat generating element away from the at least one heat generating element and across a lateral surface of the rear wall of the enclosure.