Flexible Graphite Substrate LED Light Arrangement Thermal Management
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Solution Overview
Problem
Conventional display devices face challenges in efficiently dissipating heat generated by LEDs and electronic components, leading to thermal deterioration and reduced lifespan, especially in lightweight and cost-effective designs for larger displays with increased brightness and luminous efficiency.
Innovation Solution
A flexible circuit board with a graphite substrate, featuring a dielectric layer and electrically conductive layer, is used to mount LEDs, facilitating effective heat dissipation through its anisotropic thermal conductivity, allowing heat to be directed along the planar direction and reducing junction temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional aluminum light engine arrangements are used, then structural support and thermal dissipation are provided, but weight and cost increase without sufficient thermal performance
Solution Approach 1:
The patent changes the material parameter from aluminum to graphite, exploiting graphite's superior in-plane thermal conductivity (400-500 W/mK) compared to aluminum, while achieving the same thermal dissipation performance at reduced weight and cost
Solution Approach 2:
The invention uses a composite structure combining graphite substrate with dielectric layers and conductive ink patterns, creating a hybrid material system that provides both mechanical support and optimized thermal management for LED arrays
2Illumination intensity
If brighter LEDs with higher power density are used, then luminous efficiency increases, but heat generation increases causing thermal deterioration
Solution Approach 1:
The patent converts the harmful heat generated by high-power LEDs into a manageable thermal flow by using graphite's anisotropic conductivity to channel heat laterally across the substrate, transforming the heat problem into a controlled thermal management solution
Solution Approach 2:
The invention implements localized thermal management by positioning high-conductivity graphite material directly beneath LED heat sources and using conductive ink traces to create targeted heat dissipation pathways, providing enhanced cooling precisely where needed
3Reliability
If conventional FR4 or metal core PCBs are used, then circuit board functionality is provided, but thermal management performance is insufficient
Solution Approach 1:
The patent replaces conventional FR4 or metal core PCB materials with a graphite-based composite substrate that combines the electrical circuit functionality with superior thermal management, creating a multi-functional material system
Solution Approach 2:
The invention fundamentally changes the substrate material parameter from low-conductivity FR4 or aluminum-core materials to high-conductivity graphite, achieving improved thermal management while maintaining circuit board functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible graphite substrate achieves a 9.8°C junction temperature reduction for LEDs at 4W of electrical power compared to traditional aluminum light engine arrangements, enhancing heat transfer capabilities while maintaining flexibility and reducing weight and cost.
Implementation Method 1
A flexible circuit board with a graphite substrate, featuring a dielectric layer and electrically conductive layer, is used to mount LEDs, facilitating effective heat dissipation through its anisotropic thermal conductivity, allowing heat to be directed along the planar direction
Data Source
AI summary
An LED light arrangement is provided. The light arrangement includes LED light emitting components mounted to a flexible circuit board having a flexible graphite substrate. The flexible circuit board includes a dielectric layer formed on the surface of the flexible graphite substrate and an electrically conductive layer formed on the surface of the dielectric. The high in-plane thermal conductivity graphite substrate provides enhanced heat transfer capability to effectively move of heat away from the electronic components for improved cooling of the heat generating light emitting component and surrounding devices.