Flexible Graphite Thermal Coupling for Dense Server Cooling

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Traditional cooling methods for information handling system components, such as servers, face challenges with rigid liquid cooling systems that require large tubes and thick copper components, leading to difficulties in thermal coupling and reduced component density, as well as lengthy processor replacement times and increased memory module pitch.

Innovation Solution

The use of flexible graphite as heat-rejecting media thermally coupled between thermal sources and sinks, allowing for efficient heat transfer and conforming to component shapes for enhanced thermal coupling, thereby reducing the need for rigid components and improving cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If rigid liquid cooling systems are employed, then heat transfer efficiency is improved, but device complexity and difficulty of installation increase due to large tubes and thick copper components

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidcooling system complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The patent replaces rigid copper heat sinks and large-diameter tubes with flexible graphite heat-rejecting media that can conform to component shapes. The flexible graphite material achieves effective thermal coupling without requiring thick rigid components or large tubes, thereby reducing system complexity while maintaining heat transfer efficiency.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The invention changes the physical state and properties of the heat-rejecting material from rigid metal to flexible graphite composite. This parameter change allows the material to be both thermally effective and adaptable to various component geometries, eliminating the need for complex rigid structures.

Inventive Principle:

Principle #35Parameter changes

2Temperature

If rigid copper heat sinks are used, then thermal coupling is improved, but adaptability to different component shapes deteriorates

Engineering Contradiction:

Improvethermal coupling effectivenessVSAvoidadaptability to component shapes

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The flexible graphite heat-rejecting media can be molded or bent to conform to the specific geometry of different heat-generating components such as processors, GPUs, and memory modules. This flexibility maintains effective thermal coupling across various component shapes without requiring custom rigid copper structures for each application.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The flexible graphite material serves as a universal heat-rejecting solution that can be adapted to multiple different component types and geometries. A single material formulation can be used across processors, graphics cards, memory modules, and storage devices, eliminating the need for component-specific rigid heat sink designs.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If liquid cooling systems with tubes are implemented, then cooling capability is improved, but ease of maintenance deteriorates due to lengthy processor replacement times

Engineering Contradiction:

Improvecooling capabilityVSAvoidprocessor replacement time

Core Design Contradiction:

TemperatureVSEase of repair

Solution Approach 1:

The flexible graphite heat-rejecting media is designed as a separate, removable component that can be independently installed and removed from the cooling assembly. This segmentation allows processors to be replaced without disturbing the cooling system, significantly reducing maintenance time compared to integrated rigid liquid cooling systems where tubes and heat sinks are fixed to the motherboard.

Inventive Principle:

Principle #1Segmentation

4Temperature

If memory modules with liquid cooling tubes are used, then heat dissipation is improved, but memory module pitch increases thus reducing component density

Engineering Contradiction:

Improveheat dissipationVSAvoidcomponent density

Core Design Contradiction:

TemperatureVSQuantity of substance

Solution Approach 1:

The flexible graphite heat-rejecting media for memory modules is designed as a thin, flexible layer that can be positioned between closely-spaced memory modules without requiring large-diameter cooling tubes. This thin-film approach enables effective heat dissipation while maintaining small memory module pitch and high component density on the motherboard.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables effective heat management with flexible graphite, reducing overheating risks, improving component density, and simplifying maintenance by allowing for quicker processor replacements and reduced memory module pitch, thus addressing the limitations of traditional cooling systems.

Implementation Method 1

heat-rejecting media comprising flexible graphite thermally coupled between the thermal source and the thermal sink and configured to transfer heat from the thermal source to the thermal sink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11510340B2Systems and methods for employing flexible graphite for thermal control of information handling resources

Publication Date: 2022.11.22 DELL PROD LP

AI summary

A system may include a thermal source, a thermal sink, and heat-rejecting media comprising flexible graphite thermally coupled between the thermal source and the thermal sink and configured to transfer heat from the thermal source to the thermal sink.