Flexible Gripper Claw Pressing Through Hole Inner Wall
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Solution Overview
Problem
Existing vacuum suction methods are ineffective for holding and moving semiconductor wafers with electronic components due to the uneven surface caused by the components.
Innovation Solution
A substrate pickup tool with a flexible gripper, featuring an annular mount portion and claw portions, is used to correspond with the through holes of the substrate, allowing the tool to securely pick up and move substrates with both flat and uneven surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum suction method is used to hold and move semiconductor wafer, then flat surface wafers can be held effectively, but wafers with electronic components having uneven surfaces cannot be held
Solution Approach 1:
The gripper is divided into multiple independent claw portions (first, second, third, and fourth claw portions) that can independently press against different locations of the substrate. Each claw portion can adapt to the local surface conditions, allowing the gripper to effectively hold substrates with uneven surfaces caused by electronic components while maintaining reliable holding across the entire substrate surface.
2Adaptability or versatility
If claw portions press against inner wall surface of through hole, then substrates with uneven surfaces can be held, but the structure becomes more complex than simple vacuum suction
Solution Approach 1:
The gripper employs flexible claw portions that can elastically deform to conform to the inner wall surface of the through hole. This flexibility allows the claw portions to adapt to uneven surfaces caused by electronic components without requiring a complex rigid structure with multiple adjustable components, thus achieving high adaptability with relatively simple construction.
Solution Approach 2:
Instead of having the substrate conform to a fixed gripper structure, the invention inverts the approach by having the gripper's claw portions conform to the substrate's inner wall surface. The claw portions are designed to flexibly adapt to the actual geometry of the through hole, reversing the traditional relationship between gripper and workpiece.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible gripper effectively holds and transfers substrates with electronic components by pressing against the inner wall surfaces of the through holes, enabling precise and stable installation onto assembling parts.
Implementation Method 1
the claw portions are driven to move relative to the annular mount portion for pressing against an inner wall surface of the through hole via the outer contact surface of each of the claw portions
Data Source
AI summary
A substrate pickup tool is used to pick up a substrate provided with a through hole. The substrate pickup tool includes a gripper frame and a flexible gripper. The flexible gripper includes an annular mount portion and a plurality of claw portions. The annular mount portion is mounted on the gripper frame, the claw portions are connected to the annular mount portion and each has an outer contact surface. The flexible gripper is used to correspond to the through hole of the substrate, and the claw portions are driven to move relative to the annular mount portion for pressing against an inner wall surface of the through hole via the outer contact surface of each of the claw portions.