Flexible Guide Carrier for AiP Assembly Precision
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Solution Overview
Problem
Existing methods for assembling Antenna in Package (AiP) devices on a substrate face challenges in maintaining precise positioning and spacing during assembly, leading to potential misalignment and size increase due to movement of components during soldering, which is critical for high-frequency applications like autonomous driving and 5G cellular systems.
Innovation Solution
A thin, flexible guide or carrier is used to position and maintain spacing between AiPs, allowing for precise placement and subsequent removal to ensure accurate tolerances, utilizing a frame with open areas and intersecting pieces that can be made of sacrificial materials for easy removal after assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional assembly methods are used without a guide structure, then the assembly process is simpler and faster, but the positioning precision and spacing accuracy of AiPs deteriorate due to component movement during soldering
Solution Approach 1:
A guide structure is introduced as an intermediary component during the assembly process. This guide structure temporarily holds the AiPs in their correct positions and maintains proper spacing between them during soldering. After the assembly is complete, the guide structure is removed. The guide acts as a mediator that enables precise positioning without requiring complex assembly processes or specialized equipment.
2Manufacturing precision
If rigid fixtures are used to maintain AiP spacing, then positioning accuracy is improved, but the device size increases and flexibility is reduced
Solution Approach 1:
The guide structure is designed as a thin, flexible component rather than a rigid fixture. It includes flexible arms or elements that can bend and adapt to the AiPs during placement, then maintain precise spacing during soldering. The flexibility of the guide allows it to be thin and compact, avoiding significant increases in device volume while still providing the necessary positioning accuracy.
3Stability of the object's composition
If permanent support structures are used to prevent AiP movement, then positioning stability is improved, but the device complexity and size increase permanently
Solution Approach 1:
The guide structure is designed as a temporary support that is discarded after serving its purpose. It provides stable positioning and spacing during the critical soldering phase, then is removed from the final assembly. This approach achieves the necessary positioning stability during manufacturing without permanently increasing device complexity or adding unnecessary structural elements to the final product.
4Manufacturing precision
If precise positioning methods are implemented, then manufacturing precision is improved, but the assembly time and process complexity increase
Solution Approach 1:
The guide structure is prepared in advance and has pre-formed features such as recesses, slots, or attachment points that correspond to the AiP positions. This preliminary preparation allows the AiPs to be quickly placed and secured in the correct positions without requiring complex real-time alignment procedures. The guide structure does the positioning work automatically based on its pre-designed geometry, reducing assembly time while maintaining high precision.
Data Source
AI summary
In the present invention a guide or carrier is used to assemble and position multiple AiPs (or Integrated Circuit packages) on a substrate and maintain spacing therebetween. In some examples, this reduces package size and maintains desired tolerances. The carrier or guard is to be thin and flexible so as to allow some movement but maintain tolerances at specific locations.