Flexible Heat Conduction Member for Circuit Board Deformation
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Solution Overview
Problem
The existing electronic devices face challenges in ensuring heat dissipation performance due to circuit board deformation, which can lead to either insufficient or excessive heat conduction member usage, resulting in increased thermal resistance and inefficiency.
Innovation Solution
The electronic device incorporates a heat conduction member with flexibility, strategically placed between the circuit board and housing, featuring through holes that allow the heat conduction member to redistribute and self-align, ensuring equal thermal resistance across the board, even when the circuit board deforms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the quantity of heat conduction member is increased to ensure heat dissipation when the circuit board deforms, then the heat dissipation performance is maintained, but the cost increases and the quantity of heat conduction member exceeds necessity when distance is reduced
Solution Approach 1:
The patent applies this principle by using a flexible heat conduction member that can deform and flow to adapt to circuit board deformation. The flexibility allows the heat conduction member to maintain contact and equalize thermal resistance without requiring excessive quantity, resolving the contradiction between reliability and quantity.
Solution Approach 2:
The patent applies this principle by changing the physical state of the heat conduction member from rigid to flexible, and by allowing it to flow and redistribute its material. This parameter change enables the heat conduction member to adapt to distance variations caused by circuit board deformation, ensuring heat dissipation performance while reducing the total quantity needed.
2Quantity of substance
If the quantity of heat conduction member is reduced to lower cost, then the expense decreases, but the heat dissipation performance cannot be ensured when the distance between circuit board and housing increases
Solution Approach 1:
The flexible heat conduction member can flow and extend to cover increased distances caused by circuit board deformation, maintaining heat dissipation performance with reduced quantity. The flexibility compensates for distance variations without requiring excessive material.
Solution Approach 2:
The heat conduction member self-adjusts and self-aligns by flowing to areas of greater thermal resistance. This self-service capability ensures heat dissipation performance is maintained automatically without requiring precise pre-positioning or excessive quantity to cover all possible deformation scenarios.
3Reliability
If a large quantity of heat conduction member is arranged to cover maximum estimated distance, then heat dissipation is ensured under all conditions, but the heat conduction member contacts the circuit board and housing with greater area than necessary, increasing cost
Solution Approach 1:
The flexible heat conduction member flows to exactly fill the gaps between the circuit board and housing, creating an optimal contact area that adapts to the actual distance. This eliminates the need to arrange excessive quantity in advance, reducing manufacturing cost while ensuring heat dissipation performance.
Solution Approach 2:
The heat conduction member transitions from a static arrangement to a dynamic flow process during assembly. It flows and redistributes itself to achieve optimal coverage, eliminating the need for conservative over-provisioning and reducing manufacturing cost while maintaining reliability.
4Reliability
If the heat conduction member is made flexible to adapt to circuit board deformation, then the heat dissipation performance is maintained under deformation, but the member may flow in planar direction and contact with greater area than necessary when distance is small
Solution Approach 1:
The flexible heat conduction member performs self-alignment by flowing to areas where it is most needed (areas with greater thermal resistance). When distance is small, it naturally consolidates rather than spreading excessively, because the flow is driven by thermal resistance gradients rather than arbitrary spreading. This self-service mechanism ensures optimal quantity usage while maintaining performance under deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures effective heat dissipation while reducing the total quantity of heat conduction member needed, maintaining performance by equalizing thermal resistance between electronic components and minimizing unnecessary heat conduction member presence.
Implementation Method 1
a heat conduction member is disposed between the circuit board and the housing on a side opposite to the electronic component to dissipate heat of the electronic component to the housing
Implementation Method 2
The heat conduction member has a flexibility adhering to the first and second component-opposite portions and the first and second housing opposed portions
Implementation Method 3
The circuit board is deformed during assembling of the circuit board and a housing
Data Source
AI summary
An electronic device includes a circuit board, first and second electronic components, a housing, and a heat conduction member. The first electronic component is mounted on a first surface of the circuit board, and the second electronic component is mounted on a second surface of the circuit board. The first electronic component and the second electronic component are arranged in an arrangement direction. The heat conduction member is disposed between the housing and a first component-opposite portion of the circuit board opposite to the first electronic component, and between the housing and a second component-opposite portion of the circuit board opposite to the second electronic component. The circuit board has a through hole in a formation area between the first electronic component and the second electronic component. The heat conduction member integrally covers each of the first component-opposite portion and the second component-opposite portion and the formation area of the circuit board.