Flexible Heat Dissipation Device for Space-Constrained Electronics
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Solution Overview
Problem
Conventional rigid body heat dissipation devices are limited by internal space constraints and mold release directions, making them inflexible and potentially overweight, which hinders effective heat dissipation in electronic products.
Innovation Solution
A flexible heat dissipation device comprising two flexible strips that form a strip winding portion and a fitting portion, allowing for adjustable size and shape to fit various internal spaces and heat sources, while maintaining effective heat dissipation through airflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a rigid body heat dissipation device is used to increase heat dissipation area, then heat dissipation performance is improved, but the device size is limited by internal space and mold release direction
Solution Approach 1:
The patent applies this principle by using flexible strips instead of rigid bodies to form the heat dissipation structure. The flexible strips can be bent and shaped to adapt to different internal spaces and mold release directions, while still providing sufficient heat dissipation area through their extended configuration.
Solution Approach 2:
The patent implements dynamics by creating a heat dissipation device with flexible strips that can be dynamically shaped and positioned according to the specific internal space constraints and heat source locations. The structure is not fixed but can be adapted to different configurations.
2Area of stationary object
If the heat dissipation device size is increased to improve heat dissipation, then heat dissipation area is improved, but the device becomes overweight
Solution Approach 1:
The patent uses thin flexible strip structures instead of bulky rigid components, achieving sufficient heat dissipation area with minimal material usage and weight. The flexible strips can be arranged to maximize surface area while maintaining a lightweight construction.
3Stability of the object's composition
If a rigid body heat dissipation device is used, then heat dissipation structure is stable, but the structure cannot be extended arbitrarily due to mold release direction limitations
Solution Approach 1:
The patent replaces rigid bodies with flexible strips that can be shaped and extended in arbitrary directions without being constrained by mold release directions. The flexibility allows the structure to be extended and configured according to specific design requirements while maintaining stability through proper positioning and attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible design enables the heat dissipation device to adapt to different shapes and sizes of internal spaces, maintaining effective heat dissipation while avoiding the limitations of rigid devices.
Implementation Method 1
a first flexible heat dissipation strip (110) and a second flexible heat dissipation strip (120)... form a strip winding portion (130)... maintaining effective heat dissipation
Implementation Method 2
maintaining effective heat dissipation through airflow
Data Source
AI summary
A flexible heat dissipation device includes a first flexible heat dissipation strip and a second flexible heat dissipation strip. The first flexible heat dissipation strip includes a first body portion and a first end portion, and the first end portion is connected to the first body portion. The second flexible heat dissipation strip includes a second body portion and a second end portion, and the second end portion is connected to the second body portion. The first body portion and the second body portion form a winding portion, and the first end portion is connected to the second end portion to form a fitting portion.