Flexible Heat Dissipation Panel for Foldable Electronics
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Solution Overview
Problem
Conventional air-cooled heat dissipation methods in portable electronic devices, such as notebook computers, face challenges with noise, dust, and inefficiency, especially with the increasing integration level, package density, and operating frequency of chips, and are inadequate for bendable or foldable devices.
Innovation Solution
A heat dissipation panel comprising a flexible layer and a heat conducting layer, where the flexible layer adheres to the bending region of the heat conducting layer to form a fillet, enhancing flexibility and protecting the heat conducting layer from damage, and a fan is used to accelerate air flow between high-temperature and low-temperature regions for improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If air-cooled heat dissipation method is used, then heat dissipation function is provided, but noise and dust problems occur and heat dissipation efficiency is low
Solution Approach 1:
The patent replaces the mechanical fan-based air cooling system with a thermal conduction-based heat dissipation panel. The heat dissipation panel conducts heat away from the chip through direct thermal contact, eliminating the need for mechanical air movement components, thereby removing noise and dust generation while improving heat dissipation efficiency.
Solution Approach 2:
The patent introduces a liquid cooling system where a liquid coolant flows through channels in the heat dissipation panel to absorb and transport heat away from the chip. This fluid-based thermal management system provides superior heat dissipation efficiency compared to air cooling without the drawbacks of fan-based pneumatic systems.
2Adaptability or versatility
If heat dissipation panel is bent or folded, then adaptability to foldable devices is improved, but breakage or fracture may occur
Solution Approach 1:
The patent employs a flexible substrate as the base material for the heat dissipation panel. This flexible substrate can be bent or folded without breaking, enabling the heat dissipation panel to adapt to foldable electronic devices while maintaining structural integrity and reliability during deformation.
Solution Approach 2:
The patent uses composite material construction for the heat dissipation panel, combining flexible substrate materials with thermally conductive materials. This composite structure provides both the flexibility needed for foldable devices and the thermal conductivity required for effective heat dissipation, while the composite design enhances overall durability during bending and folding operations.
3Productivity
If integration level and operating frequency of chips increase, then processing performance is improved, but heat generation increases and conventional heat dissipation becomes inadequate
Solution Approach 1:
The patent extracts heat away from the chip more efficiently by introducing dedicated liquid cooling channels that directly contact or closely approach the heat-generating components. This extraction approach removes heat at its source before it can accumulate, enabling the system to handle higher processing performance and heat generation from high-frequency chips.
Solution Approach 2:
The patent utilizes liquid coolant flowing through internal channels to actively transport heat away from high-power chips. This hydraulic cooling system provides superior heat removal capability compared to passive air cooling, enabling effective thermal management of high-integration, high-frequency processors that generate significant heat.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the risk of breakage or fracture, enhances heat dissipation efficiency, and minimizes space and noise issues compared to traditional air-cooled methods, while effectively managing heat in foldable or bendable electronic devices.
Implementation Method 1
a first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat
Implementation Method 2
a fan is used to accelerate air flow between high-temperature and low-temperature regions for improved heat dissipation
Data Source
AI summary
A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.