Flexible Heat Pipe Cooling for Electronic Modules
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In electronic module cooling on circuit boards, limited space often prevents direct placement of cooling devices, and existing solutions are inflexible and not adaptable to different module arrangements, especially when multiple modules are present.
Innovation Solution
A cooling device comprising a common heat dissipating unit connected to multiple heat absorbing bodies via flexible heat pipes, allowing for adaptable placement and orientation to accommodate various module arrangements and mechanical tolerances, with enhanced heat conductivity and mechanical robustness through embedded rigid sections and cooling ribs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a common heat dissipating device is used for multiple electronic modules, then space utilization is improved, but adaptability to different module arrangements deteriorates
Solution Approach 1:
The cooling system is segmented into a common heat dissipating device and multiple separate heat absorbing bodies, each independently connectable to different electronic modules. This segmentation allows the heat dissipating device to remain stationary and space-efficient while the heat absorbing bodies can be flexibly positioned and connected to various module configurations through flexible heat pipes.
Solution Approach 2:
The heat pipes are designed with flexible intermediate sections that can dynamically adapt to different spatial arrangements. The flexible sections allow the heat absorbing bodies to be positioned at various locations and orientations relative to the common heat dissipating device, enabling the system to adapt to different electronic module arrangements without redesigning the entire cooling system.
2Manufacturing precision
If heat absorbing bodies are placed close to electronic modules, then heat conduction efficiency is improved, but mechanical robustness deteriorates due to limited space for rigid connections
Solution Approach 1:
The heat pipes incorporate flexible intermediate sections that can bend and deform to accommodate tight spaces between electronic modules and the common heat dissipating device. These flexible sections maintain thermal conductivity while providing the mechanical compliance needed to fit into confined spaces where rigid connections would be impossible.
Solution Approach 2:
The flexible heat pipes act as intermediaries between the heat absorbing bodies and the common heat dissipating device. They transfer heat efficiently while accommodating mechanical tolerances and spatial constraints, bridging the gap between the need for close thermal contact and the need for mechanical robustness in limited spaces.
3Reliability
If individual cooling devices are placed on each electronic module, then cooling effectiveness is improved, but space requirements worsen
Solution Approach 1:
Multiple individual cooling functions are merged into a single common heat dissipating device that serves multiple electronic modules simultaneously. The heat absorbing bodies distributed across different modules all connect to this shared dissipating device, reducing the total space required compared to having separate cooling devices for each module while maintaining effective cooling through the flexible heat pipe connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat from electronic modules in confined spaces and adapts to different module configurations, ensuring efficient cooling even in densely packed arrangements.
Implementation Method 1
a heat pipe heat-conductively connecting the heat absorbing plate with the heat sink... at least one heat absorbing body is heat-conductively connected to the common heat dissipating device via at least one flexible heat pipe
Implementation Method 2
The flexible heat pipe comprises a heat absorbing end section, a heat dissipating end section, and an axial and lateral flexible intermediate section
Implementation Method 3
at least one heat absorbing body and/or the common heat dissipating device is at least partly provided with cooling ribs and/or cooling pins... cooling by upstream air convection is enhanced
Data Source
AI summary
The present invention relates to a device (1) for cooling of at least two electronic modules (2) that are arranged on a circuit board (3), characterized by a common heat dissipating device (4) and at least two heat absorbing bodies (5), wherein each heat absorbing body (5) is heat-conductively connected to the common heat dissipating device (4) and can be heat-conductively connected to one of the electronic modules (2), wherein at least one heat absorbing body (5) is heat-conductively connected to the common heat dissipating device (4) via at least one flexible heat pipe (6), the heat pipe (6) comprising a heat absorbing end section (7), a heat dissipating end section (8), and an axial and lateral flexible intermediate section (9), with the axial and lateral flexible intermediate section (9) being arranged between the heat absorbing end section (7) and the heat dissipating end section (8).