Flexible Heat Spreader for 3D Package Thermal Stress
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Solution Overview
Problem
Conventional 3D packaging technologies face challenges with thermal stress and heat dissipation due to rigid heat spreaders, leading to reduced reliability and increased manufacturing costs, especially in high power density devices where the gap between the die and PCB is narrow, hindering circuit design flexibility.
Innovation Solution
A package module with a flexible heat spreader that conformally covers the substrate and die, utilizing a thermally conductive layer with an adhesion layer to enhance heat dissipation without the need for a stiffener, allowing for efficient thermal management and reduced thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rigid heat spreader is used to dissipate heat from high power density MPMs, then heat dissipation is improved, but thermal stress increases causing delamination and cracks
Solution Approach 1:
The patent applies a flexible heat spreader made of thin film material that can conformally cover the MPM surface and adapt to thermal expansion/contraction, preventing delamination and cracks while maintaining effective heat dissipation from high power density devices
2Stability of the object's composition
If a stiffener is used to hold the heat spreader, then structural stability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent extracts and eliminates the stiffener component from the conventional heat spreader structure, achieving structural stability through the flexible heat spreader's inherent properties and adhesion layers alone, thereby reducing device complexity and manufacturing cost
Solution Approach 2:
The patent merges the functions of the stiffener and adhesion layer into a unified flexible heat spreader structure, where the flexible material itself provides both structural support and thermal conduction, eliminating the need for separate stiffening components
3Temperature
If a rigid heat spreader is used, then heat dissipation is improved, but the narrow gap between die and PCB hinders circuit design flexibility
Solution Approach 1:
The flexible heat spreader can conformally cover the MPM surface and adapt to different package configurations, enabling effective heat dissipation while accommodating various circuit designs and die arrangements without requiring large gaps between die and PCB
4Adaptability or versatility
If different sized stiffeners are used for different MPM sizes, then adaptability is improved, but manufacturing cost increases
Solution Approach 1:
The flexible heat spreader can be configured in different sizes and shapes to match various MPM configurations, providing universal applicability across different package sizes while simplifying manufacturing through the elimination of separate stiffener components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible heat spreader effectively dissipates heat from high power dies, increases device reliability by reducing thermal stress, and lowers manufacturing costs by eliminating the need for additional stiffeners, while maintaining circuit design flexibility.
Implementation Method 1
A flexible heat spreader conformally covers the substrate and the die... effectively dissipates heat from high power dies
Implementation Method 2
utilizing a thermally conductive layer with an adhesion layer to enhance heat dissipation
Data Source
AI summary
A package module is provided. The package module includes a substrate having a surface including a die region. A die is disposed in the die region of the surface on the substrate. A flexible heat spreader conformally covers the surface of the substrate and the die. The invention also discloses an electronic device with the package module.