Flexible Heat Spreader for 3D Component Conformity
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Solution Overview
Problem
Conventional electronic devices face challenges in effectively managing heat generated by heat-generating components, leading to temperature rises that can hinder device performance and affect adjacent components.
Innovation Solution
A heat spreader is designed with a flexible package made of thin polyethylene film enclosing a paste-like thermal conductive medium, which deforms to conform to the three-dimensional shape of heat-generating components, allowing for efficient heat dissipation by making direct or indirect contact through a sheet-type thermal conductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid heat spreader is used, then heat conduction efficiency is improved, but adaptability to three-dimensional component shapes deteriorates
Solution Approach 1:
The patent applies a flexible package structure made of thin polyethylene film to enclose the thermal conductive medium. This flexible packaging allows the heat spreader to deform and conform to three-dimensional component shapes while maintaining effective thermal contact, resolving the contradiction between rigid structure for heat conduction and flexibility for shape adaptation.
Solution Approach 2:
The patent changes the physical state of the thermal conductive medium from solid to liquid or paste-like state within the flexible package. This parameter change allows the medium to flow and adapt to complex component geometries while maintaining high thermal conductivity, thereby achieving both good heat conduction and shape adaptability.
2Adaptability or versatility
If thermal conductive paste is used, then adaptability to component shapes is improved, but heat conduction efficiency deteriorates
Solution Approach 1:
The patent uses a composite structure combining a flexible polyethylene film package with thermal conductive medium inside. This composite design leverages the flexibility of the film for shape adaptation and the high thermal conductivity of the enclosed medium for efficient heat transfer, resolving the contradiction between adaptability and heat conduction efficiency.
3Ease of repair
If a flexible package is used, then ease of repair and replacement is improved, but structural stability deteriorates
Solution Approach 1:
The flexible polyethylene film package enables easy removal and replacement of the heat spreader for repair purposes, while the sealed structure maintains structural integrity and stability during operation. The flexibility of the film allows for easy manipulation during repair without compromising the enclosed thermal conductive medium.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents heat concentration, prolongs the time before components reach high temperatures, enabling continuous operation and providing high thermal conductivity while being gentle on components and facilitating repair.
Implementation Method 1
a thermal conductive medium 9 which is liquid or paste-like
Data Source
Figure 1~2
Figure 3~4
Figure 5A~6A
AI summary
An electronic device includes: a circuit board with mounted components including a heat-generating electronic element mounted thereon; a casing configured to internally hold the circuit board; and a heat spreader configured to be held in the casing together with the circuit board, the heat spreader being formed by enclosing a liquid or paste-like thermal conductive medium in a flexible package and configured to deform to conform to a three-dimensional shape of the heat-generating electronic element and periphery thereof on the circuit board.