Flexible Heat Spreader for Electronic Device Thermal Management
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Solution Overview
Problem
Electronic devices, such as mobile phones and tablets, face challenges in heat management due to increasing power generation and decreasing size, which limits heat dissipation surface area, leading to potential damage from overheating. Existing cooling methods are either cumbersome, prone to wear, or increase power consumption.
Innovation Solution
A heat management apparatus featuring a heat spreader with high conductivity (at least 100 W/mK) that couples to the device, extends beyond its surface, and is flexible to wrap around contours, providing additional utility like a stand or input device, while maintaining effective heat dissipation without increasing device size or power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the device size is increased to provide greater surface area for heat dissipation, then heat dissipation capability is improved, but device portability and ease of handling deteriorate
Solution Approach 1:
The heat spreader extends beyond the device boundaries into the surrounding space, utilizing three-dimensional space for heat dissipation rather than being confined to the device surface. This allows the heat dissipation surface area to be decoupled from the device volume, resolving the contradiction between compact size and heat dissipation capability.
Solution Approach 2:
The heat spreader is divided into a first portion coupled to the device and a second portion extending away from the device. This segmentation allows the heat dissipation function to be separated from the device body, enabling effective heat dissipation without increasing the device's portable form factor.
2Temperature
If passive cooling ports are added to increase air circulation, then heat dissipation is improved, but device reliability deteriorates due to dust and liquid infiltration
Solution Approach 1:
The heat dissipation function is extracted from the device interior and implemented externally through the extending heat spreader. This eliminates the need for internal cooling ports that would compromise device sealing and reliability, as heat dissipation occurs through the external surface of the heat spreader rather than through openings in the device housing.
3Temperature
If active cooling systems are added to increase air circulation, then heat dissipation is improved, but device complexity and power consumption increase
Solution Approach 1:
The heat spreader utilizes passive convection and radiation to dissipate heat from its extended surface area without requiring any active cooling components. The system serves itself by leveraging natural heat transfer mechanisms, eliminating the need for fans, pumps, or other active cooling systems that would increase complexity and power consumption.
Solution Approach 2:
By extending the heat dissipation surface into the surrounding three-dimensional space rather than relying on internal air circulation, the invention achieves effective heat dissipation through passive surface-area-based convection and radiation, eliminating the need for active cooling systems.
4Temperature
If traditional heat sinking structures are added to the device, then heat dissipation is improved, but device portability deteriorates
Solution Approach 1:
The extending second portion of the heat spreader serves multiple functions: it provides heat dissipation surface area while simultaneously functioning as a stand or support structure for the device. This multi-functionality reduces the need for separate components, potentially reducing overall device weight and improving portability while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat spreader effectively manages heat dissipation in electronic devices, preventing overheating and damage, while maintaining portability and reducing power drain, and offering additional functional features like a stand or input device.
Implementation Method 1
The heat spreader has a heat conductivity of at least approximately 100 Watts per meter Kelvin (W/mK)
Data Source
AI summary
A heat management apparatus for an electronic device that includes a heat spreader. The heat spreader has a top surface and a bottom surface. A first portion is coupled to the electronic device. A second portion extends away from the electronic device. The heat spreader has a heat conductivity of at least approximately 100 Watts per meter Kelvin (W/mK). In some configurations the heat spreader may comprise a woven graphite material or a graphene material with a heat conductivity of at least approximately 1000 W/mK.