Flexible Heat Spreader for Hinge Rotation in Computing Devices
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Solution Overview
Problem
As computing devices become smaller and more powerful, thermal management becomes a significant challenge due to increased heat generation in a smaller space, leading to inefficiencies and potential device failure if heat dissipation is not effectively managed.
Innovation Solution
A flexible heat spreader is introduced, comprising a dynamic portion that extends through the hinge of a computing device, with static portions attached to the base and display, utilizing a thin layer of graphite for conductive heat transfer, allowing for efficient heat dissipation from the base to the display, even during rotation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a rigid heat spreader is used to transfer heat from base to display, then heat dissipation efficiency is improved, but the device cannot accommodate hinge rotation and display movement
Solution Approach 1:
The patent applies this principle by using a thin film heat spreader made of highly conductive material that can flex and bend to accommodate hinge rotation between the base and display, while still maintaining effective heat transfer from the base to the display housing
Solution Approach 2:
The patent applies this principle by creating a composite structure with a thin film heat spreader that combines high thermal conductivity with flexibility, allowing the material to simultaneously conduct heat efficiently and adapt to mechanical movement at the hinge joint
2Adaptability or versatility
If the heat spreader is made thin to allow flexibility, then adaptability to hinge rotation is improved, but thermal conductivity may be reduced
Solution Approach 1:
The patent applies this principle by changing the material parameters of the heat spreader, selecting materials with extremely high thermal conductivity that can achieve effective heat transfer even in a thin, flexible form factor, thus maintaining thermal performance while enabling mechanical flexibility
3Power
If computing devices are made smaller and more powerful, then processing capability is improved, but heat generation in a smaller space increases
Solution Approach 1:
The patent applies this principle by extending the heat dissipation path from the base into the display housing, utilizing the third dimension (depth/vertical space) to distribute heat over a larger volume and surface area, thereby reducing heat generation density in the compact form factor
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution improves heat dissipation, reducing maximum skin temperature at the base while maintaining it within safe limits, enabling higher processing speeds and longer operation times for the CPU, and can be applied to various electronic devices, including laptops and mobile phones.
Implementation Method 1
utilizing a thin layer of graphite for conductive heat transfer
Data Source
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AI summary
Thermal management devices for a computing device are described herein. A thermal management device includes a layer of a first material included in a dynamic portion of the thermal management device and a static portion of the thermal management device. The dynamic portion of the thermal management device is bendable relative to the static portion of the thermal management device when the thermal management device is physically connected to a display and a chassis of the computing device, and the display rotates relative to a chassis. The layer of material has a first side and a second side. The second side is opposite the first side. The thermal management device also includes a first layer of a second material and a second layer of the second material physically connected to the first side and the second side of the static portion of the layer of the first material, respectively.