Flexible Heat Spreader for Hinged Device Thermal Balance

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Solution Overview

Problem

Hinged electronic devices often experience thermal imbalance due to heat-generating components being predominantly located on one side, leading to uneven heating and potential overheating issues on the other side.

Innovation Solution

A flexible heat spreader design is implemented, where a thermally conductive flexible member extends across the hinge assembly from the heat-generating side to the cooler side, thermally coupled to both a heat spreader and a heat dissipation member, facilitating the transfer of heat from the components to the dissipation member.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If heat-generating components are concentrated on one side of the hinged device, then device complexity is reduced and component layout is simplified, but thermal imbalance occurs causing overheating on one side and uneven heating

Engineering Contradiction:

Improvecomponent layout complexityVSAvoidthermal balance

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

A flexible heat spreader member is introduced as an intermediary thermal conduction path between the heat-generating components on one side and the heat dissipation structures on the other side. This flexible member extends across the hinge assembly, acting as a thermal mediator that redistributes heat from the concentrated source to cooler regions, thereby resolving the thermal imbalance while maintaining the simplified component layout

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a flexible heat spreader member that can bend and conform to the hinge assembly's movement. This flexible thin film structure enables thermal conduction across the articulated joint without rigid constraints, allowing heat to be distributed across the flexible portion and into the cooler side of the device while accommodating the mechanical flexibility required for the hinged configuration

Inventive Principle:

Principle #30Flexible shells and thin films

2Temperature

If a flexible heat spreader is added to distribute heat across the hinge assembly, then thermal balance is improved, but device complexity and structural complexity increase

Engineering Contradiction:

Improvethermal balanceVSAvoidthermal management structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The flexible heat spreader member serves multiple functions simultaneously: it acts as a thermal conduction path, a structural bridge across the hinge assembly, and a flexible element that accommodates mechanical movement. By integrating these multiple functions into a single component, the patent improves thermal balance without proportionally increasing overall device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent utilizes materials with high thermal conductivity for the flexible heat spreader member, changing the thermal parameters of the hinge assembly region. By selecting materials and designs that optimize thermal conductivity while maintaining flexibility, the system achieves improved heat distribution without requiring complex active thermal management systems

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively distributes heat across the device, maintaining optimal operating temperatures and preventing overheating on the cooler side, thereby enhancing the thermal management and longevity of the electronic device.

Implementation Method 1

The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9980412B2Flexible heat spreader

Publication Date: 2018.05.22 INTEL CORP

AI summary

Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.