Flexible Hinge With Heat Spreader Support Across Rotating Joints
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Solution Overview
Problem
Existing electronic devices face thermal challenges due to increasing performance demands, leading to reduced device performance and lifetime, with current heat transfer solutions through hinges experiencing high thermal resistance and reliability issues, especially in thin clamshell designs.
Innovation Solution
A flexible hinge design that accommodates a flexible heat spreader, allowing heat transfer across the hinge area without damaging the heat spreader, using a hinge mechanism with rollers and springs to support the flexible heat spreader during rotation, enabling efficient heat transfer from one housing to another.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid heat spreader is used in a hinge, then heat transfer efficiency is improved, but the heat spreader becomes damaged during hinge rotation
Solution Approach 1:
The patent replaces the rigid heat spreader with a flexible heat spreader that can bend and deform as the hinge rotates. This flexible heat spreader maintains thermal contact with both housing portions while accommodating the mechanical movement, thus preventing damage while enabling heat transfer across the rotating hinge joint.
Solution Approach 2:
The hinge mechanism is designed to dynamically adjust its configuration during rotation, allowing the flexible heat spreader to change shape and position accordingly. This dynamic adaptation ensures continuous thermal coupling between housing portions while accommodating the full range of motion without compromising the heat spreader.
2Reliability
If a flexible heat spreader is used in a hinge, then heat spreader durability is improved, but thermal resistance increases
Solution Approach 1:
The flexible heat spreader is constructed from composite materials that combine high thermal conductivity with flexibility. This allows the heat spreader to maintain efficient heat transfer pathways while being able to deform during hinge rotation, thus reducing thermal resistance despite the flexible construction.
Solution Approach 2:
The hinge mechanism includes intermediary elements such as thermal adhesives or interface materials that enhance thermal coupling between the flexible heat spreader and the housing portions. These intermediaries compensate for any gaps or contact resistance introduced by the flexible nature of the heat spreader.
3Volume of moving object
If the device is made thinner, then device portability is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The flexible heat spreader enables heat transfer in the third dimension by routing thermal pathways through the hinge joint and across housing portions. This vertical heat transfer path compensates for the reduced horizontal space available in thinner devices, maintaining heat dissipation capability while reducing overall device thickness.
Solution Approach 2:
The flexible heat spreader allows for optimized thermal pathway geometry that adapts to the thin device profile. By changing the shape and configuration parameters of the heat spreader to match the compact form factor, efficient heat transfer is maintained despite the reduced thickness and available volume for traditional heat dissipation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible hinge design enhances thermal performance by reducing thermal resistance and preventing damage to the heat spreader, allowing for higher performance and quieter operation in thinner devices.
Implementation Method 1
A flexible hinge design that accommodates a flexible heat spreader, allowing heat transfer across the hinge area
Implementation Method 2
using a hinge mechanism with rollers and springs to support the flexible heat spreader during rotation
Data Source
Figure 1A
Figure 1B
Figure 1C
AI summary
Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.