Flexible Hinge Via Patterning for Post-Cure Property Tuning
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Solution Overview
Problem
Conventional methods for optimizing flexible hinge performance are time-consuming, costly, and inefficient, and once the composite layup is cured, the mechanical properties of the hinge cannot be adjusted to meet design specifications.
Innovation Solution
Customization of flexible hinges through the use of vias in the hinge material to tailor mechanical properties, allowing for adjustment even after curing, by laser drilling micro/nano holes to achieve desired performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional design of experiments (DOEs) is used to optimize hinge performance, then hinge performance can be improved, but the process becomes time-consuming, costly, and inefficient
Solution Approach 1:
The patent applies parameter changes by modifying the physical structure of the hinge through laser drilling of micro/nano holes (vias) in the hinge material. This directly changes the mechanical properties of the hinge after curing, allowing performance optimization without time-consuming DOEs. The vias alter the stress distribution and mechanical behavior of the hinge, achieving the desired performance rapidly.
Solution Approach 2:
The patent replaces the conventional mechanical optimization approach (DOEs involving multiple iterations of design, manufacturing, and testing) with a direct laser drilling process. This substitution eliminates the need for repeated mechanical prototyping and testing, significantly reducing optimization time and cost while maintaining or improving hinge performance.
2Stability of the object's composition
If composite layup is cured to achieve desired mechanical properties, then hinge structure is stabilized, but the ability to adjust mechanical properties is lost
Solution Approach 1:
The patent applies preliminary action by laser drilling the vias in the hinge material before final curing or during the curing process. This preliminary modification of the hinge structure allows for subsequent adjustment of mechanical properties even after the composite layup is cured, as the vias can be created or modified without compromising the structural integrity of the cured composite.
Solution Approach 2:
The patent introduces dynamics by making the hinge structure modifiable after curing through laser drilling. The mechanical properties of the hinge are no longer fixed after curing but can be dynamically adjusted by creating or modifying vias, allowing the hinge to adapt to different performance requirements while maintaining structural stability.
3Adaptability or versatility
If vias are formed in hinge material to customize mechanical properties, then adaptability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces complex mechanical or chemical methods of modifying hinge properties with laser drilling. The laser process directly creates vias in the hinge material through ablation, eliminating the need for complex tooling, molds, or chemical treatments. This substitution simplifies the manufacturing process while enabling precise customization of hinge mechanical properties.
Solution Approach 2:
The patent applies local quality by creating vias at specific locations within the hinge material to achieve desired mechanical properties in specific regions. The laser drilling process allows precise control over the location, size, and distribution of vias, enabling localized modification of hinge properties without affecting the entire structure. This targeted approach simplifies manufacturing compared to global modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient development and adjustment of flexible hinges to meet specific design criteria, reducing production deviations and simplifying the process while ensuring optimal performance.
Implementation Method 1
The hinge material can be relieved by drilling vias with a laser or other methods
Data Source
Figure 1
Figure 2A~2D
Figure 3A~3C
AI summary
The present description relates to flexible hinges and hinged devices. The flexible hing of a foldable device (102) comprises a hinge area (210) interposed between wing areas (212), wherein the flexible hinge material of the hinge area (210) defining multiple linearly arranged vias (104) that weaken the flexible hinge material to define a hinge axis (HA) along which the relieved flexible hinge flexes when the first and second portions are rotated through a range of orientations.