Flexible IC Assembly Heat Dissipation for Compact Displays

The patent employs flexible thermally conductive layers (including mesh structures) that can be conformally applied to IC chips and folded to fit compact housing spaces. These flexible thermal management components maintain effective thermal contact while adapting to limited space configurations, enabling heat dissipation in ultra-slim display devices without requiring traditional rigid heat sink structures.

The patent replaces traditional mechanical thermal management approaches with flexible thermally conductive material layers that directly interface with IC chips. These flexible thermal layers provide efficient heat conduction pathways without requiring bulky mechanical heat sink structures, enabling effective thermal management for high-speed data transmission applications in space-constrained environments.

The patent substitutes rigid heat sink structures with flexible thermally conductive layers that can be conformally applied to IC chips and folded to fit tight housing spaces. The flexible thermal management solution maintains effective thermal contact through material compliance while enabling the assembly to be flexed into compact configurations without damaging mechanical or electrical connections.

The patent employs flexible substrates and thermally conductive layers that are specifically designed to accommodate bending and folding without compromising structural integrity. These flexible components maintain mechanical and electrical connection reliability even when the IC assembly is flexed to fit within compact housing spaces, eliminating the need for rigid structures that would prevent adaptation to tight configurations.