Flexible IC Substrate Channel Patterning for Clean Singulation
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Solution Overview
Problem
Conventional methods for manufacturing integrated circuits on flexible substrates are time-consuming and generate waste, with poor edge quality and significant local heating, and the process of dicing flexible substrates using lasers or abrasive water jets results in inefficient substrate use and 'dirty' waste material.
Innovation Solution
A process involving a carrier with a patterned flexible substrate where the substrate is selectively removed to form channels between IC units, allowing for precise patterning and easier integration, using techniques like plasma treatment and metal seeding layers to prevent adhesion and facilitate IC formation and singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dicing flexible substrates using laser or abrasive water jet is used, then ICs can be separated from the substrate, but the process is time-consuming and generates dirty waste material
Solution Approach 1:
The patent extracts the ICs from the flexible substrate by removing the substrate material itself between the ICs, rather than using dicing methods that cut through the ICs. This is achieved by selectively removing substrate material to create separation channels, which eliminates the need for time-consuming laser or water jet dicing and avoids generating dirty waste material.
Solution Approach 2:
The patent replaces the mechanical dicing system (laser or abrasive water jet) with a chemical or thermal removal process that selectively eliminates substrate material between ICs. This substitution eliminates the harmful mechanical cutting process and its associated waste generation while improving manufacturing efficiency.
2Manufacturing precision
If dicing flexible substrates using laser or abrasive water jet is used, then ICs can be separated, but poor edge quality and significant local heating occur
Solution Approach 1:
The patent removes substrate material between ICs through selective elimination rather than cutting through the ICs themselves. This extraction approach creates clean separation channels with precise edges, avoiding the thermal damage and poor edge quality associated with laser or water jet dicing.
Solution Approach 2:
The patent replaces the thermal and mechanical dicing processes with a selective material removal process that does not generate significant local heating. This substitution eliminates the thermal damage and poor edge quality inherent in conventional dicing methods.
3Productivity
If dicing flexible substrates is performed, then ICs can be separated, but substrate waste is significant
Solution Approach 1:
The patent extracts only the necessary substrate material between ICs to create separation channels, rather than removing large portions of the substrate through dicing. This selective extraction minimizes substrate waste while maintaining manufacturing efficiency.
Solution Approach 2:
The patent removes and discards only the minimal substrate material between ICs that is necessary for separation, while preserving and retaining the valuable ICs and maximum substrate area. This approach significantly reduces substrate waste compared to conventional dicing methods.
4Ease of operation
If adhesive film is used to hold wafer, then ICs can be handled, but additional release process is required
Solution Approach 1:
The patent removes the need for adhesive films and separate release processes by directly forming ICs on a carrier substrate that can be easily separated. The carrier substrate itself serves as the handling medium, eliminating the need for additional adhesive layers and release steps.
Solution Approach 2:
The patent makes the carrier substrate multi-functional by using it both as the support during IC formation and as the handling medium during IC separation and transfer. This eliminates the need for separate adhesive films and release processes, simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces substrate waste, improves edge quality, and streamlines the manufacturing process by enabling more efficient handling and integration of ICs, with the potential for reduced material costs and enhanced manufacturing efficiency.
Implementation Method 1
The mechanism will depend on whether the electromagnetic radiation source causes predominantly a photonic ablation (through absorption) or a thermal process
Implementation Method 2
The mechanism will depend on whether the electromagnetic radiation source causes predominantly a photonic ablation (through absorption) or a thermal process (e.g. heat-release)
Implementation Method 3
using techniques like plasma treatment and metal seeding layers to prevent adhesion
Implementation Method 4
using techniques like plasma treatment and metal seeding layers to prevent adhesion and facilitate IC formation and singulation
Data Source
AI summary
The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.