Flexible IC Package with Embedded Heat Transfer Member
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Solution Overview
Problem
Current technologies for flexible integrated circuit device packages do not adequately meet the requirements of high capacity, thin thickness, and reduced size, necessitating more efficient solutions for flexible integrated circuit device packages and electronic components.
Innovation Solution
An electronic component comprising an integrated circuit device package with a first substrate randomly bent or spread, incorporating a heat transfer member for efficient heat transfer during thermo compression bonding with a second substrate, which includes a flexible film and adhesion member to ensure stable and effective combination and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible integrated circuit device package is used to achieve high capacity and reduced size, then the package can be bent or spread for various applications, but the package experiences thermal stress and bonding failures due to inadequate heat transfer
Solution Approach 1:
A heat transfer member (metal layer or bead) is introduced as an intermediary between the first substrate and second substrate to facilitate efficient thermal energy transfer during bonding, preventing thermal stress accumulation while maintaining package flexibility
Solution Approach 2:
The thermal conductivity parameter is enhanced by incorporating metal materials (Cu, Al, Fe) into the heat transfer member, enabling efficient heat dissipation during the bonding process while preserving the flexible nature of the polymer substrate
2Adaptability or versatility
If the first substrate is made flexible to allow random bending, then the package can be applied in various configurations, but heat transfer during thermo compression bonding becomes inefficient
Solution Approach 1:
The first substrate is constructed as a composite structure combining a flexible polymer base material with embedded metal heat transfer members, achieving both flexibility for bending and high thermal conductivity for efficient heat transfer during bonding
Solution Approach 2:
Heat transfer members are strategically positioned at specific locations (through holes or buried within) the first substrate where thermal energy transfer is most critical, providing localized thermal enhancement without compromising overall substrate flexibility
3Volume of moving object
If the integrated circuit device is made thinner to reduce package size, then the package meets reduced size requirements, but the device becomes more susceptible to damage during bending
Solution Approach 1:
The adhesion member and heat transfer member are positioned beforehand to provide mechanical support and stress distribution to the thin integrated circuit device during bending operations, preventing damage before it occurs
Solution Approach 2:
The package employs flexible polymer substrates and adhesion members that can accommodate the thin profile of the integrated circuit device while providing the necessary mechanical protection during bending and handling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables stable and efficient combination of the integrated circuit device package with the second substrate, preventing failures due to bending and thermal stress, while allowing for flexible application and effective heat management.
Implementation Method 1
a heat transfer member disposed in the first substrate, an integrated circuit device being randomly bent or spread, a first pad disposed on one face of the integrated circuit device, and an adhesion member disposed between the integrated circuit device and the first substrate. The second substrate may be randomly bent or spread. The second substrate may include a second pad. In example embodiments, the integrated circuit device package may be combined with the second substrate by a thermo compression bonding process in which the heat transfer member may transfer a heat to the second substrate through the first substrate
Implementation Method 2
an adhesion member disposed between the integrated circuit device and the first substrate
Data Source
AI summary
An electronic component may include an integrated circuit device package and a second substrate. The integrated circuit device package may include a first substrate being bent or spread, a heat transfer member disposed in the first substrate, an integrated circuit device being bent or spread, a first pad disposed on one face of the integrated circuit device, and an adhesion member disposed between the integrated circuit device and the first substrate. The second substrate may be bent or spread. The second substrate may include a second pad. The integrated circuit device package may be combined with the second substrate by a thermo compression bonding process in which the heat transfer member may transfer a heat to the second substrate through the first substrate and the first pad may make contact with the second pad.