Flexible IC Modules with Embedded Semiconductor Dies
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Solution Overview
Problem
Conventional rigid microchips and printed circuit boards are incompatible with applications requiring stretchable or bendable circuitry, and existing methods for creating flexible circuits are costly and result in undesirably thick composite structures, especially for 'thin chip' configurations.
Innovation Solution
Embedding silicon or other semiconductor dies in a layer of thermoplastic polymer or polyimide adhesive within a flexible polymeric substrate, surrounded by conductive metallic coatings, to create a flexible integrated circuit module with a reduced thickness and lower material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional rigid microchips and printed circuit boards are used, then electrical performance and circuit density are maintained, but flexibility and bendability are lost
Solution Approach 1:
The patent embeds rigid semiconductor dies within flexible polymeric substrates and encapsulating layers, creating a composite structure where the rigid functional components are surrounded by flexible materials. This allows the circuit to bend and stretch while maintaining electrical connectivity, directly resolving the contradiction between rigidity and flexibility.
Solution Approach 2:
The invention creates a composite structure combining rigid semiconductor dies with flexible polymeric materials (substrates and encapsulating layers). This composite approach allows the system to exhibit both the electrical performance of rigid chips and the mechanical flexibility of polymers, simultaneously achieving electrical functionality and mechanical adaptability.
2Adaptability or versatility
If existing methods for creating flexible circuits are used, then flexibility is achieved, but manufacturing cost increases and module thickness increases
Solution Approach 1:
The patent extracts the semiconductor die from its traditional rigid package and embedding it directly into flexible substrates, eliminating the need for intermediate rigid circuit board structures. This extraction of the die from conventional packaging reduces material requirements and simplifies the manufacturing process, lowering costs while maintaining flexibility.
Solution Approach 2:
The invention transitions from traditional planar rigid circuit board mounting to three-dimensional embedding within flexible substrates. By changing the spatial arrangement from surface-mount on rigid boards to embedded within flexible layers, the design achieves flexibility without requiring multiple expensive material layers, reducing both cost and thickness.
3Adaptability or versatility
If existing methods for creating flexible circuits are used, then flexibility is achieved, but module thickness increases
Solution Approach 1:
The patent nests the semiconductor die within the flexible substrate and encapsulating layers, creating a compact integrated structure. The die is embedded within the polymer matrix rather than being mounted on the surface, which minimizes the overall thickness of the flexible circuit module while maintaining flexibility and protecting the die.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of flexible electronic devices with embedded semiconductor dies that can be bent or stretched without compromising electrical performance, reducing manufacturing costs and minimizing module thickness, while maintaining high conductivity and thermal isolation.
Implementation Method 1
Embedding silicon or other semiconductor dies in a layer of thermoplastic polymer or polyimide adhesive within a flexible polymeric substrate
Implementation Method 2
surrounded by conductive metallic coatings, to create a flexible integrated circuit module
Implementation Method 3
maintaining high conductivity and thermal isolation
Data Source
AI summary
Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic-based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer.