Flexible IC Packaging Substrate for Chip-on-Chip and Package-on-Package
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Solution Overview
Problem
Integrated circuit packaging technologies, such as chip-on-chip and package-on-package, come with associated risks and tradeoffs in terms of reliability and size, with chip-on-chip being riskier but potentially reducing overall package volume, while package-on-package is more reliable but larger.
Innovation Solution
A packaging solution that supports both chip-on-chip and package-on-package configurations using a package substrate with conductors and pads, allowing for flip-chip connections and orthogonal stacking, which can transition from chip-on-chip to package-on-package if the former proves unreliable, maintaining reliability while reducing package size if successful.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If chip-on-chip packaging is used to reduce package volume, then the overall package size is reduced, but the reliability risk increases
Solution Approach 1:
The package substrate is designed with dynamic reconfigurability, allowing the packaging configuration to transition between chip-on-chip and package-on-package modes based on reliability performance. This enables the system to adapt its structure in response to operational feedback, optimizing both size and reliability over time
Solution Approach 2:
The invention changes the operational parameters of the packaging system by allowing transition between different packaging configurations. The package substrate can switch between supporting chip-on-chip (smaller size) and package-on-package (higher reliability) arrangements, effectively adjusting the reliability-size parameter tradeoff based on actual performance
2Reliability
If package-on-package technology is used to ensure reliability, then reliability is improved, but the package size increases
Solution Approach 1:
The package substrate provides dynamic reconfigurability, allowing transition from the more conservative package-on-package configuration to the more compact chip-on-chip configuration once reliability is validated. This enables the system to start with higher reliability and then optimize for size
Solution Approach 2:
The invention implements preliminary action by initially supporting package-on-package configuration to ensure reliability before committing to the smaller chip-on-chip approach. The system validates the chip-on-chip reliability in advance before fully transitioning to that configuration
3Adaptability or versatility
If the package substrate is designed to support both chip-on-chip and package-on-package configurations, then flexibility and risk management are improved, but the initial package substrate size is larger than necessary
Solution Approach 1:
The package substrate is designed with dynamic reconfigurability, allowing the system to transition between different packaging configurations. The substrate can adapt its effective size and configuration based on which packaging mode is active, optimizing the size-flexibility tradeoff over time
Solution Approach 2:
The package substrate is designed with multi-functionality to support both chip-on-chip and package-on-package configurations. This universal design allows the same substrate to serve multiple packaging purposes, improving flexibility while managing risk through configuration options
Data Source
AI summary
In one embodiment, a packaging solution for an application integrated circuit (IC) and one or more other ICs is provided. The packaging solution may support both chip-on-chip packaging of the application IC (in flip-chip connection to a package substrate) and other ICs (in non-flip chip orientation), and package-on-package packaging of the application IC and the other ICs. The package substrate may include a first set of pads proximate to the application IC to support chip-on-chip connection to the other ICs. The pads may be connected to conductors that extend underneath the application IC, to connect to the application IC. A second set of pads may be connected to package pins for package-on-package solutions. If the chip-on-chip solution proves reliable, support for the package-on-package solution may be eliminated and the package substrate may be reduced in size.