Flexible Image Sensor Module Anti-EMI Design
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Solution Overview
Problem
Existing image-sensing modules with anti-EMI functions are limited by thick hard substrates, which hinder their integration into thin portable devices due to increased thickness and susceptibility to cracking, and require conductive glue for effective shielding.
Innovation Solution
A flexible image-sensing module with a conductive structure that includes a flexible substrate, conductive layers, and an anti-EMI unit, where the anti-EMI unit is disposed on the bottom surface to guide electromagnetic waves, reducing overall thickness and eliminating the need for conductive glue, while maintaining effective shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a hard substrate is used to provide structural support and anti-EMI protection, then the module achieves electromagnetic shielding, but the substrate thickness increases and the module becomes prone to cracking
Solution Approach 1:
The patent replaces the traditional hard substrate with a flexible substrate that has anti-EMI properties. The flexible substrate uses a thin film structure with conductive layers embedded within, providing electromagnetic shielding without requiring thick rigid material. This resolves the contradiction by achieving anti-EMI protection through a thin, flexible structure rather than a thick hard substrate.
Solution Approach 2:
The flexible substrate is constructed as a composite material system consisting of a flexible base material with integrated conductive layers. This composite structure combines the flexibility and thinness of the base material with the electromagnetic shielding properties of the conductive layers, achieving both reduced thickness and effective anti-EMI protection.
2Strength
If the substrate thickness is increased to prevent cracking during assembly, then the module durability improves, but the overall module thickness increases
Solution Approach 1:
The flexible substrate inherently resists cracking due to its material properties, eliminating the need for increased thickness to prevent cracks. The flexible nature allows the substrate to deform without breaking during assembly, while maintaining a thin profile that keeps the overall module thickness reduced.
3Reliability
If an anti-EMI element is added to shield electronic elements, then electromagnetic interference protection is achieved, but the module thickness increases
Solution Approach 1:
The anti-EMI functionality is merged into the flexible substrate itself through integrated conductive layers. Instead of adding a separate anti-EMI element as a distinct component, the shielding function is combined with the substrate structure, eliminating the need for additional thickness while maintaining effective electromagnetic protection.
Solution Approach 2:
The flexible substrate serves multiple functions simultaneously: it provides structural support, enables flexibility, and delivers electromagnetic shielding through its integrated conductive layers. This multi-functionality eliminates the need for separate dedicated anti-EMI elements, keeping the module thickness reduced.
4Reliability
If conductive glue is used to achieve anti-EMI effect, then electromagnetic shielding is effective, but the assembly complexity and manufacturing difficulty increase
Solution Approach 1:
The conductive shielding function is merged into the substrate structure through integrated conductive layers during substrate manufacturing. This eliminates the need for separate conductive glue application steps, simplifying the assembly process and reducing manufacturing complexity while maintaining effective electromagnetic shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible module achieves reduced thickness, enhanced durability, and effective anti-EMI functionality without conductive glue, allowing for thinner portable device designs and improved assembly reliability.
Implementation Method 1
The conductive structure is electrically connected between the electronic element unit and the anti-EMI unit to guide electromagnetic waves generated by the electronic element unit to the anti-EMI unit
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 2
AI summary
A flexible thin image-sensing module with anti-EMI function includes a flexible substrate unit, an electronic element unit, an anti-EMI unit, and a conductive structure. The electronic element unit has a plurality of electronic elements disposed on a top surface of the flexible substrate unit, and the electronic elements at least include an image sensor, a low dropout regulator and a backend IC. The anti-EMI unit is disposed on a bottom surface of the flexible substrate unit. The conductive structure passes through the flexible substrate unit and is electrically connected between the electronic element unit and the anti-EMI unit in order to guide electromagnetic waves generated by the electronic element unit to the anti-EMI unit.