Flexible Insulating Tip for Semiconductor Probe Discharge Suppression
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Solution Overview
Problem
Existing semiconductor evaluation apparatuses face challenges in suppressing partial discharge phenomena during electrical characteristic evaluation, which can lead to defects in semiconductor devices, and often result in foreign material or rubber mark transfer to the device surface, causing further defects in subsequent processes.
Innovation Solution
An evaluation apparatus with a flexible insulating body having a frame shape that surrounds probes, featuring a tip portion with a contact surface that deforms to contact the semiconductor device, thereby elongating the creeping distance and reducing the risk of discharge, while also removing foreign materials and marks through its elastic properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating member is pressed to the semiconductor device to prevent discharge, then discharge suppression is improved, but foreign material or marks are transferred to the device surface causing defects
Solution Approach 1:
The patent employs a flexible insulating body with a tip portion that can elastically deform to contact the semiconductor device. This flexible contact method suppresses discharge by maintaining continuous contact while accommodating surface irregularities, and the elastic recovery removes foreign materials and marks from the device surface, solving both the discharge suppression and contamination problems simultaneously.
Solution Approach 2:
The patent changes the physical state of the insulating body from rigid to flexible, allowing it to deform and adapt to the semiconductor device surface. This parameter change enables the insulating body to effectively suppress discharge while its elastic recovery removes contaminants, resolving the contradiction between discharge suppression and contamination prevention.
2Reliability
If a silicon rubber is pressed to the semiconductor chip end portion to prevent discharge, then discharge suppression is improved, but rubber marks are transferred to the chip surface causing defects
Solution Approach 1:
The patent uses a flexible insulating body that can elastically deform to contact the semiconductor device surface. This flexible contact suppresses discharge effectively while the elastic recovery mechanism removes rubber marks and foreign materials from the chip surface, resolving the contradiction between discharge suppression and surface quality maintenance.
Solution Approach 2:
The insulating body performs self-cleaning through its elastic recovery. When the tip portion contacts the device surface to suppress discharge, the subsequent elastic recovery automatically removes foreign materials and marks from the surface, making the system self-service and eliminating the need for separate cleaning operations.
3Reliability
If the insulating body tip portion has flexibility to contact the semiconductor device, then discharge suppression is improved, but the structure becomes more complex
Solution Approach 1:
The patent implements a flexible insulating body with a tip portion that can elastically deform. This flexible structure achieves effective discharge suppression by adapting to the semiconductor device surface while maintaining relative simplicity through the use of elastic materials and straightforward geometric design, balancing reliability improvement with structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively suppresses partial discharge and prevents foreign material or mark transfer to the semiconductor device, reducing defects and improving the reliability of the evaluation process.
Implementation Method 1
The insulating body includes a tip portion which has flexibility and faces the main surface of the stage. The tip portion includes, in one side surface of the tip portion, a contact surface which can come in contact with the semiconductor device by a deformation of the tip portion
Implementation Method 2
the insulating body includes a tip portion which has flexibility and faces the main surface of the stage. The tip portion includes, in one side surface of the tip portion, a contact surface which can come in contact with the semiconductor device by a deformation of the tip portion toward an inner side or an outer side of the frame shape
Data Source
AI summary
Provided is an evaluation apparatus of a semiconductor device suppressing a discharge occurring in a part of a semiconductor device at a time of evaluating its electrical characteristics. The evaluation apparatus of a semiconductor device includes a stage to support a semiconductor device; a plurality of probes located above the stage; an insulating body having a frame shape to surround the plurality of probes and located above the stage; and an evaluation part injecting a current into the semiconductor device via the plurality of probes. The insulating body includes a tip portion having flexibility and facing the stage. The tip portion includes, in one side surface of the tip portion, a contact surface to come in contact with the semiconductor device by a deformation of the tip portion toward an inner side or an outer side of the frame shape.