Flexible Integrated Module Packages with Leadframes

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Solution Overview

Problem

Integrated Circuit (IC) package technologies face challenges with bulk and energy inefficiency, particularly in applications requiring miniaturization, where traditional Printed Circuit Board (PCB) systems are not optimal, and custom silicon or substrate designs are costly and time-consuming.

Innovation Solution

The development of flexible and integrated module packages using leadframes, which involve forming a leadframe panel with leads and pockets, attaching base chips and electronic components, wire bonding, and encapsulating them with molding compound to create miniaturized, highly integrated modules with reduced engineering development time and cost.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If traditional PCB systems are used for electronic component integration, then ease of manufacture and adaptability are maintained, but miniaturization capability and energy efficiency deteriorate

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing complexity

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent divides the package into modular components: a leadframe carrier with multiple pockets, base chips, and overmolded components. Each pocket can independently accommodate different electronic components, allowing the package to be segmented into functional modules that can be manufactured and assembled separately before final integration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent implements nested structures where base chips are mounted on the leadframe carrier, electronic components are mounted on the base chips, and the entire assembly is then overmolded with encapsulant material. This nested arrangement allows multiple components to be integrated in a compact, space-efficient manner that achieves miniaturization.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Adaptability or versatility

If custom silicon or substrate designs are developed for specialized packaging, then performance and integration are improved, but engineering development time and cost increase

Engineering Contradiction:

Improvepackage customizationVSAvoiddevelopment time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The leadframe carrier is designed as a universal platform with multiple standardized pockets that can accommodate various types of electronic components. The carrier structure, leadframe configuration, and overmolding process are standardized to work with different component types, allowing a single package design to serve multiple applications without requiring custom silicon or substrate development.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent performs preliminary actions by pre-attaching base chips to the leadframe carrier and pre-configuring the pocket structures before final component assembly. The leadframe is pre-formed with standardized lead configurations and pocket geometries, allowing rapid integration of different electronic components without requiring time-consuming custom design iterations.

Inventive Principle:

Principle #10Preliminary action

3Productivity

If multiple electronic components are integrated into a single package, then miniaturization and functionality are achieved, but manufacturing precision and assembly complexity increase

Engineering Contradiction:

Improveintegration densityVSAvoidassembly precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent introduces base chips as intermediary elements between the leadframe carrier and the electronic components. The base chips serve as mounting substrates that simplify the attachment of electronic components to the leadframe, providing a standardized interface that reduces assembly precision requirements while enabling high integration density.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The overmolding process utilizes parameter changes by transitioning the encapsulant material from a liquid or semi-liquid state to a solid state through controlled curing. This phase change allows the material to flow into and around all components, automatically conforming to their positions and providing precise encapsulation without requiring high-precision manual positioning of each component.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS11476182B2Assembly of flexible and integrated module packages with leadframes

Publication Date: 2022.10.18 SHENZHEN CHIPULLER CHIP TECH CO LTD

AI summary

Described is a packaged component having a first surface and an opposite second surface. The packaged component may comprise a first element a second element, and a third element. The first element may have a first surface and an opposite second surface. The second element may have a first surface and an opposite second surface. The third element may electrically connect a portion of the first element to a portion of the second element. The second surface of the first element may be adjacent to the second surface of the packaged component, and the second surface of the second element may be adjacent to the second surface of the packaged component.