Flexible Interconnect Tape Camera Module for AR VR Integration
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Solution Overview
Problem
Existing camera modules are too large for next-generation wearable products such as augmented reality (AR) and virtual reality (VR) glasses, which require smaller dimensions to fit seamlessly into these designs.
Innovation Solution
The camera module is fabricated using high-density interconnect (HDI) tape, which includes an image sensor die, passive electronic components, and flexible interconnect tape. This configuration reduces the physical package dimensions by converting wire bond dies to flip chip configuration using Through Silicon Vias (TSVs) and bonding with gold stud bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional camera module designs are used, then manufacturing and assembly are simpler, but the physical dimensions are too large for next-generation wearable products
Solution Approach 1:
The patent transitions from traditional rigid PCB-based camera modules to flexible interconnect tape, enabling the camera module to be bent and conform to curved surfaces. This dimensional flexibility allows integration into wearable devices with limited space, directly addressing the size constraint while maintaining functional complexity
Solution Approach 2:
The patent employs flexible interconnect tape instead of rigid printed circuit boards, allowing the camera module to achieve a thin-profile design. The flexible tape enables the module to bend and adapt to wearable form factors, reducing the overall volume while managing the complexity of flexible interconnect fabrication
2Length of stationary object
If wire bond dies are converted to flip chip configuration using TSVs and gold stud bumps, then the physical package dimensions are reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent performs Through Silicon Via (TSV) formation and gold stud bump attachment on the image sensor die before mounting it to the flexible interconnect tape. This preliminary preparation of the die in flip chip configuration enables subsequent reduction of package length, as the bonding interfaces are pre-established, facilitating miniaturization despite increased initial fabrication complexity
Solution Approach 2:
The patent changes the bonding configuration from wire bond to flip chip with gold stud bumps, fundamentally altering the electrical connection methodology. This parameter change enables shorter package length by eliminating wire bond extensions, while accepting the trade-off of more complex TSV and bump fabrication processes
3Weight of stationary object
If the camera module is made smaller and lighter, then it is more suitable for wearable products, but thermal dissipation becomes more challenging
Solution Approach 1:
The patent introduces flexible interconnect tape as an intermediary substrate that provides thermal management capabilities. The tape serves as both an electrical interconnect medium and a thermal conduction pathway, enabling heat dissipation from the compact image sensor die while maintaining the lightweight and small form factor required for wearable applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach results in a low-profile, small-sized, and lightweight camera module that can be easily integrated into AR and VR glasses, while maintaining effective thermal dissipation and protection for the image sensor die.
Implementation Method 1
converting wire bond dies to flip chip configuration using Through Silicon Vias (TSVs)
Implementation Method 2
bonding with gold stud bumps
Data Source
AI summary
A camera module includes an image sensor die, high-density interconnect (HDI) tape, and a number of passive electronic components. The image sensor die has a first side and a second side. The first side includes a pixel array, and the second side includes a number of bonding pads. The HDI tape is a flexible substrate coupled to the image sensor. The HDI tape includes a number of traces positioned between a first side and a second side. The first side of the HDI tape is coupled to the second side of the image sensor die. The passive electronic components are coupled to the second side of the HDI tape and provide rigidity to the camera module.