Flexible Interconnect Layer Using 2D Materials and Conductive Polymers

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Solution Overview

Problem

Current flexible devices face challenges in creating effective interconnect layers for wearable electronics due to limitations in material flexibility and conductivity, particularly when using two-dimensional (2D) materials like graphene and transition metal dichalcogenides.

Innovation Solution

A flexible device structure incorporating a first and second flexible interconnect layer with a 2D material layer and conductive polymer layers, arranged in specific orders, along with a low-dielectric constant dielectric layer and through electrodes, to enhance electrical connectivity and durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If two-dimensional materials like graphene are used for interconnect layers, then conductivity is improved, but flexibility and durability are compromised

Engineering Contradiction:

ImproveconductivityVSAvoidflexibility and durability

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent uses composite materials by combining 2D material layers (graphene, TMD) with conductive polymer layers and dielectric layers to create flexible interconnect structures that maintain high conductivity while achieving the required flexibility and mechanical durability for wearable devices

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent employs thin film structures where 2D material layers are deposited as ultra-thin conductive films, and flexible polymer layers are used as protective shells that provide mechanical strength and flexibility while allowing the 2D materials to maintain their electrical properties

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If 2D material layers are used for interconnect lines, then electrical connectivity is enhanced, but the layers become vulnerable to damage

Engineering Contradiction:

Improveelectrical connectivityVSAvoidvulnerability to damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies beforehand cushioning by depositing protective dielectric layers and flexible polymer layers over the fragile 2D material layers before device assembly, creating a protective structure that cushions the 2D materials against mechanical damage while preserving their electrical connectivity function

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent uses intermediary layers (conductive polymers, dielectric layers) that are deposited over the 2D material layers to protect them from damage, while these intermediaries also serve functional purposes such as providing additional conductivity pathways or electrical isolation

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If flexible polymers are used to protect 2D material layers, then durability is improved, but manufacturing complexity increases

Engineering Contradiction:

ImprovedurabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into the flexible polymer layers, which simultaneously provide mechanical protection, serve as dielectric layers for capacitor structures, and act as adhesive layers bonding different device components, thereby reducing the total number of separate manufacturing steps

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS10134676B2Flexible device having flexible interconnect layer using two-dimensional materials

Publication Date: 2018.11.20 SAMSUNG ELECTRONICS CO LTD

AI summary

A flexible device includes an electronic device having an electrode and a flexible interconnect layer formed on the electrode. The flexible interconnect layer includes a two-dimensional (2D) material and a conductive polymer to have high electric conductivity and flexibility. The flexible device includes a flexible interconnect layer of one or more layers, and in this case, includes a low-dielectric constant dielectric layer between the respective layers.