Flexible Interconnect Rivet Connections for Lightweight Circuit Assemblies
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Solution Overview
Problem
Conventional electrical harnesses require large, bulky wires for efficient power and signal transmission, which are costly and difficult to handle, and lack flexible interconnect solutions for efficient component connections.
Innovation Solution
The use of flexible interconnect circuits with conductive elements connected by support structures like rivets, allowing for efficient electrical connections and mechanical support, enabling the assembly of multiple narrow-width circuits instead of large two-dimensional ones, and facilitating connections to printed circuit boards without conventional connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If conventional wires with insulating sleeves are used for power and signal transmission, then electrical connections can be established, but the wires become bulky and heavy
Solution Approach 1:
The patent divides the wire assembly into separate functional layers: a flexible circuit board with conductive traces for signal transmission, and a separate adhesive layer for mechanical bonding. This segmentation eliminates the need for bulky insulating sleeves around each wire, reducing overall weight and complexity while maintaining electrical isolation through the PCB substrate itself.
Solution Approach 2:
The patent introduces an adhesive layer as an intermediary between the flexible circuit board and the component or housing. This adhesive mediator provides both mechanical bonding and electrical isolation functions, replacing the need for traditional insulating sleeves and reducing the overall complexity of the wire assembly structure.
2Reliability
If large wires are used to transmit power and signals, then current transmission efficiency is improved, but handling and flexibility deteriorate
Solution Approach 1:
The patent transitions from traditional three-dimensional wire bundles to a two-dimensional flexible circuit board layout. Conductive traces are patterned on the flexible substrate, allowing current transmission in planar form factors. This dimensional change enables efficient power and signal transmission while providing superior flexibility and ease of handling compared to bulky wires.
Solution Approach 2:
The patent uses a flexible circuit board with thin conductive traces patterned on a flexible substrate. This thin-film approach replaces large, rigid wires with flexible, lightweight conductive paths that maintain electrical efficiency while dramatically improving handling and bendability characteristics.
3Reliability
If conventional connectors are used to interconnect wires, then electrical connections are established, but the connectors become bulky and heavy
Solution Approach 1:
The patent merges the electrical connection function directly into the flexible circuit board through conductive traces and contact pads. Traditional separate connectors are eliminated as the PCB itself provides both structural support and electrical connectivity. This integration reduces connector weight and complexity while maintaining reliable electrical connections through direct trace-to-contact bonding.
4Reliability
If multiple individual wires with insulating sleeves are used, then electrical isolation is maintained, but material costs and manufacturing complexity increase
Solution Approach 1:
The patent segments the electrical isolation function into the PCB substrate itself, where different conductive traces are isolated by the non-conductive PCB material. This eliminates the need for individual insulating sleeves on each wire, reducing material costs and manufacturing complexity while maintaining reliable electrical isolation through the layered PCB structure.
Solution Approach 2:
The PCB substrate serves multiple functions simultaneously: it provides structural support, electrical isolation between conductors, mechanical flexibility, and a platform for mounting components. This multi-functionality replaces the need for separate insulating sleeves and simplifies manufacturing while maintaining electrical isolation reliability.
Data Source
AI summary
Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.