Flexible Interconnect Rivet Joints for Compact Vehicle Harnesses
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Solution Overview
Problem
Conventional vehicle harnesses face challenges with bulky connectors, resistive heating, and thermal dissipation, leading to the need for smaller, lighter, and more efficient interconnect solutions.
Innovation Solution
The development of circuit assemblies using flexible interconnect circuits, where conductive elements are connected via support structures like rivets, allowing for efficient stacking and electrical connection of multiple circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If conventional wires and connectors are used in vehicle harnesses, then electrical connections can be established, but the system becomes bulky and heavy
Solution Approach 1:
The patent divides the traditional wire-harness-connector system into segmented flexible interconnect circuits. Each circuit board contains integrated conductive traces that replace multiple individual wires, and multiple circuit boards can be stacked and connected through aligned conductive elements, eliminating the need for bulky conventional connectors
Solution Approach 2:
The patent transitions from a two-dimensional wire bundle arrangement to a three-dimensional stacked configuration of flexible circuit boards. Conductive elements are arranged in overlapping patterns across multiple layers, with support structures extending through the stack to provide both mechanical support and electrical connectivity, utilizing vertical space efficiently
2Temperature
If larger wires are used to reduce resistive heating, then thermal dissipation improves, but the harness size and weight increase
Solution Approach 1:
The flexible interconnect circuits use composite construction with conductive traces on dielectric substrates. Multiple thin conductive layers can be stacked and parallel-connected to achieve low equivalent resistance without requiring thick individual conductors, while the dielectric material provides thermal management pathways
Solution Approach 2:
The patent distributes current carrying paths across multiple layers and dimensions rather than relying on a single thick wire. Conductive elements in different layers can be connected in parallel through the stack, effectively increasing the total cross-sectional area for current flow and heat dissipation without increasing the footprint or weight proportionally
3Reliability
If conventional connectors are used for interconnecting wires, then electrical connections are established, but the connectors are bulky and heavy
Solution Approach 1:
The patent merges the functions of mechanical support and electrical connection into integrated support structures. These structures provide both mechanical alignment and electrical pathways, eliminating the need for separate connector housings and contact elements that characterize conventional connectors
Solution Approach 2:
The patent extracts the essential functions of connection (mechanical alignment and electrical conductivity) from the bulky connector housing. The support structures provide only the necessary functions without the excess material and complexity of traditional connector assemblies
Data Source
AI summary
Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.