Flexible Interconnect Structure for Sensor Assembly Vibration
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Solution Overview
Problem
The existing methods for interconnecting sensor assemblies, such as pressure sensors, are labor-intensive and prone to failure under high vibration, leading to increased costs, reduced quality, and performance issues due to the need for hand-wiring and complex connections.
Innovation Solution
A flexible interconnect structure comprising rigid and flexible sections with specific connection points, allowing for efficient coupling of sensor structures to components like circuit boards, reducing the number of connections required and enhancing reliability through the use of traces and connection points for secure soldering or crimping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hand-wiring wires to headers is used for interconnection, then sensor assembly can be connected to other devices, but assembly process becomes labor-intensive and failure rate increases under high vibration
Solution Approach 1:
The patent merges the interconnection function into the sensor assembly housing itself by integrating a circuit board and connection terminals directly into the housing structure. This eliminates the need for separate hand-wiring of wires to headers, reducing assembly steps while improving connection reliability under vibration through rigid soldered connections rather than manual wire attachments.
Solution Approach 2:
The patent introduces a circuit board as an intermediary component that provides standardized connection terminals (such as PCB pads or connectors) between the sensor elements and external devices. This intermediary structure replaces direct wire-to-header connections, enabling more reliable soldered or press-fit connections that resist vibration while simplifying the manufacturing process through standardized mounting procedures.
2Adaptability or versatility
If multiple separate connection points are used for sensor interconnection, then comprehensive electrical connections can be established, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent makes the housing structure multi-functional by integrating it as both the mechanical enclosure and the electrical interconnection platform. The circuit board mounted within the housing provides multiple connection terminals that serve various sensor elements and output signals, eliminating the need for separate connection structures and reducing overall device complexity while maintaining comprehensive connectivity options.
Solution Approach 2:
The patent nests the circuit board and connection terminals within the housing structure, creating a compact integrated assembly where the circuit board is contained within the housing cavity. This nesting arrangement allows multiple connection points to be organized in a compact, structured manner, reducing spatial complexity while maintaining adaptability for various connection configurations.
Data Source
AI summary
This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.