Flexible Interconnection Wires for Fragile Component Bonding
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Solution Overview
Problem
Current methods for manufacturing multi-component devices, such as smart cards and electronic inserts, are costly and inflexible due to the use of rigid substrates and fragile components that are difficult to connect using traditional methods like thermo-compression or soldering, especially when dealing with components like biometric sensors.
Innovation Solution
A method involving the production of interconnection wires on a substrate by depositing individual wires according to a predefined pattern, with terminal connection portions exposed for connection, using a conductive adhesive and potentially embedding these wires in a flexible fabric substrate with a reinforcing layer, allowing for flexible manufacturing and connection of fragile components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional rigid substrates and soldering methods are used, then mechanical strength is improved, but manufacturing cost increases and flexibility decreases
Solution Approach 1:
The patent changes the substrate parameter from rigid to flexible material, and changes the connection method from soldering to conductive adhesive bonding. This allows the device to maintain mechanical resistance while reducing manufacturing complexity and cost, as conductive adhesive requires less precision and equipment than soldering
Solution Approach 2:
The patent uses composite construction with flexible substrate material combined with conductive adhesive and metal traces. This composite approach enables the device to achieve adequate mechanical strength through material combination rather than relying on rigid substrates, thereby reducing overall manufacturing cost
2Reliability
If traditional soldering or thermo-compression methods are used, then electrical connection is achieved, but fragile components are damaged
Solution Approach 1:
The patent replaces the mechanical soldering process (which involves high temperature and mechanical stress) with conductive adhesive bonding. This substitution eliminates the harmful thermal and mechanical effects that damage fragile components like biometric sensors, while still achieving reliable electrical connection through the adhesive's conductive properties
3Stability of the object's composition
If rigid substrates are used, then structural stability is improved, but device flexibility decreases
Solution Approach 1:
The patent changes the substrate rigidity parameter to create a flexible substrate. This enables the device to bend and adapt to different form factors while maintaining structural stability through the integrated circuit board's design and the adhesive bonding strength, thereby achieving both stability and flexibility
4Reliability
If integrated circuit production methods are used, then electrical interconnection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the interconnection function from the integrated circuit production process. Instead of creating complex printed circuit boards with multiple layers and soldering operations, the invention uses simple conductive adhesive bonding with metal traces on a flexible substrate, significantly reducing manufacturing complexity while maintaining electrical interconnection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables economical and flexible production of multi-component devices with improved mechanical resistance and reduced costs by decoupling interconnection track manufacturing from other production steps, allowing for efficient connection of fragile components without the need for soldering or rigid substrates.
Implementation Method 1
the connection is made by a conductive adhesive (G) provided between the terminal portion and the contact
Data Source
Figure 1~3
Figure 4~6
Figure 7~10
AI summary
Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires, and device thereby obtained. The invention relates to a method of producing a device comprising at least two distinct components which are interconnected on a substrate by at least one interconnecting wire. The method is noteworthy in that it comprises the following steps: creating the interconnecting wire (3) by depositing individual wires on the substrate (2, 2f, 2b) in a predefined interconnecting pattern, the said wire comprising at least one terminal connection portion (7, 8) which is exposed on the substrate, bringing at least one contact (5, 6) of a component (C1, C3) to face the terminal portion (7b, 8b) and connecting the contact to this terminal portion. The invention also relates to the device thereby obtained and to a multi-component product comprising same.