Flexible Interposer for BGA Rework Without Heat Damage
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Solution Overview
Problem
The removal and reconnection of BGA devices from printed circuit boards often result in damage to the ball grid array, requiring specialized equipment like rework solder machines that can expose the device to heat, altering its internal state and defeating the purpose of testing.
Innovation Solution
The use of interposers with flexible substrates and arrays of conductive rings allows for the quick removal and reconnection of BGA devices to PCBs using a simple soldering iron, minimizing heat exposure and preserving the device's original state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If a rework solder machine is used to remove and reconnect BGA devices, then the BGA device can be connected or reconnected to the PCB, but the BGA device is exposed to heat levels that can alter the associated circuit components
Solution Approach 1:
The patent introduces an interposer as an intermediary component between the BGA device and the PCB. The interposer includes a first array of conductive rings that couple to the BGA device's ball pads and a second array of conductive rings that couple to the PCB's connectors. This intermediary structure enables connection and reconnection of the BGA device without requiring a rework solder machine, thereby avoiding heat exposure that could alter the device's internal state.
Solution Approach 2:
The interposer is segmented into distinct functional arrays: a first array of conductive rings for coupling to the BGA device and a second array of conductive rings for coupling to the PCB. This segmentation allows the BGA device to be connected to the interposer independently from the PCB, enabling troubleshooting and reconnection without exposing the device to harmful heat levels.
2Speed
If mechanical means such as grinding are used to remove the BGA chip from the PCB, then the BGA chip can be removed, but damage occurs to the ball grid array requiring a re-balling process
Solution Approach 1:
The interposer is designed with conductive rings pre-configured in arrays that correspond to the BGA device's ball pad arrangement. This preliminary configuration allows the BGA device to be directly coupled to the interposer without requiring removal of existing solder balls or re-balling processes, thereby preserving the integrity of the ball grid array while enabling quick removal and reconnection.
3Ease of repair
If specialized knowledge and tooling are required for rework solder machine operation, then proper reconnection can be achieved, but the process is not always available to technicians in remote locations
Solution Approach 1:
The interposer serves as a portable intermediary that enables field technicians to connect and disconnect BGA devices without requiring specialized rework solder machines or extensive specialized knowledge. The interposer's conductive ring arrays provide a straightforward coupling mechanism that can be implemented with basic tools, making the process accessible to technicians in remote locations while maintaining proper connection quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables technicians to connect and disconnect BGA devices without damaging the ball grid array, maintaining the integrity of the device under test and allowing for proper investigation without heat-induced alterations.
Implementation Method 1
a first array of conductive rings formed in a first pattern on the flexible substrate, wherein the first array of conductive rings is attached to an array of ball pads of a ball grid array device
Data Source
AI summary
Interposers for coupling a ball grid array (BGA) device to a printed circuit board (PCB) and related methods are provided. One such method involves aligning a first array of conductive rings on a flexible substrate of the interposer with ball pads of a BGA device, coupling the first conductive rings to the ball pads, aligning a second array of conductive rings on the flexible substrate with connectors of a first PCB including an array of connectors, and coupling the second conductive rings to the array of connectors of the first PCB. One such interposer assembly includes a flexible substrate, a first array of conductive rings on the flexible substrate, wherein the first conductive rings is attached to an array of ball pads of a BGA device, a second array of conductive rings on the flexible substrate, and conductive traces connecting the first and second conductive rings.