Flexible Interposer Stacked Body with Folded Portions

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Solution Overview

Problem

Existing interposer technologies face challenges in achieving desired shapes, particularly with narrow widths and high aspect ratios, due to breakage during division and difficulty in processing thick substrates, limiting their versatility and accuracy in electronic device connections.

Innovation Solution

The development of an interposer with a stacked body of flexible insulating layers, including folded portions with reduced bend radii, concave areas, and conductor patterns for electrical connectivity, allowing for easy shaping and deformation to achieve complex geometries, and using thermoplastic resin layers for ease of manufacturing and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If an interposer with a narrow width portion is divided from a mother substrate, then the interposer can be obtained, but the narrow width portion breaks easily during division

Engineering Contradiction:
Improveinterposer shapeVSAvoidbreakage resistance
Core Design Contradiction:
ShapeVSReliability

Solution Approach 1:

The interposer is divided into a first insulating layer and a second insulating layer, with conductor patterns provided between them. This segmentation allows the narrow width portion to be structurally supported during division, preventing breakage while achieving the desired interposer shape.

Inventive Principle:
Principle #1Segmentation

2Length of stationary object

If a mother substrate with large thickness is processed, then a thick interposer can be configured, but it is difficult to accurately cut out a shape with high aspect ratio

Engineering Contradiction:
Improveinterposer thicknessVSAvoidcutting accuracy
Core Design Contradiction:
Length of stationary objectVSManufacturing precision

Solution Approach 1:

The thick interposer is segmented into multiple insulating layers (first and second insulating layers) stacked on each other. This layering approach enables accurate shaping of high aspect ratio features while maintaining the desired overall thickness, as each layer can be processed independently with better precision.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The conductor patterns are provided between the first and second insulating layers in the stacking direction, utilizing the third dimension to achieve electrical connectivity. This allows accurate cutting of high aspect ratio shapes in the planar directions while maintaining large thickness in the stacking direction.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If conventional interposer structures are used, then electrical connection is achieved, but the interposer cannot easily have any desired shape

Engineering Contradiction:
Improveelectrical connectivityVSAvoidshape flexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The interposer is segmented into first and second insulating layers with conductor patterns positioned between them. This segmented structure provides both electrical connectivity (through the conductor patterns) and shape flexibility (through the layered insulating structure that can be configured in various shapes including narrow width portions and high aspect ratio features).

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10806033B2Interposer and electronic device
Publication Date: 2020.10.13 MURATA MFG CO LTD
  • US10806033B2 patent drawing
  • US10806033B2 patent drawing
  • US10806033B2 patent drawing

AI summary

An interposer includes a stacked body including first and second mounting surfaces that face each other, a first electrode on the first mounting surface, and a second electrode on the second mounting surface. The stacked body includes flexible insulating layers stacked on each other, and a folded portion. The first and second electrodes are electrically connected to each other. The stacked body includes an upright portion between the first and second mounting surfaces and in which a stacking direction in which the insulating layers are stacked is parallel to the first and second mounting surfaces, and a bent portion bent in a plan view of the first and second mounting surfaces.