Component Mounting Board with Flexible Interposer for Space Optimization
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Solution Overview
Problem
In electronic devices like smartphones, the increasing importance of camera performance and multimedia usage leads to a competition for space on the main board, making it challenging to secure component mounting space efficiently, while also dealing with issues like warpage and solder non-bonding phenomena during assembly, which increases costs.
Innovation Solution
A component mounting board design featuring first and second relatively rigid substrates connected by a flexible substrate, with an interposer providing a signal transmission path between them, allowing for a multilayer structure that simplifies manufacturing and reduces costs by minimizing defects such as warpage and solder non-bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple cameras and large speakers are arranged on the main board to improve camera performance and multimedia functionality, then device functionality is enhanced, but component mounting space becomes insufficient
Solution Approach 1:
The patent transitions from a traditional single-plane PCB layout to a three-dimensional stacked configuration with first and second substrates arranged vertically. This dimensional change allows components to be distributed across multiple layers, effectively increasing the available mounting space while maintaining a compact footprint suitable for modern smartphones with multiple cameras and large speakers.
Solution Approach 2:
The patent implements a nested structure where the second substrate is positioned on top of the first substrate, with the flexible substrate connecting them. This nesting approach allows compact arrangement of multiple functional layers, maximizing space utilization for various components including cameras and speakers within the limited device volume.
2Area of stationary object
If a complex multilayer substrate structure is used to increase component mounting space, then space utilization is improved, but manufacturing complexity and assembly difficulties increase
Solution Approach 1:
The patent employs a flexible substrate to connect the first and second rigid substrates. This flexible interconnection layer simplifies the overall structure compared to rigid multilayer PCBs, as it can be bent and shaped to accommodate the stacked configuration without requiring complex rigid support structures, thereby reducing manufacturing complexity while maintaining the multilayer space advantage.
Solution Approach 2:
The patent divides the substrate system into separate first and second substrates connected by a flexible substrate, rather than using a single complex multilayer rigid PCB. This segmentation allows each substrate to be manufactured and prepared independently, then assembled together, reducing the overall manufacturing complexity and improving assembly feasibility compared to a monolithic multilayer structure.
3Strength
If rigid substrates are used to provide structural support, then mechanical strength is improved, but warpage and solder non-bonding phenomena occur during assembly
Solution Approach 1:
The flexible substrate serves as a compliant interconnection layer between the two rigid substrates, absorbing thermal expansion differences and mechanical stresses that would otherwise cause warpage and solder joint failures. This flexible element maintains mechanical strength while preventing assembly reliability issues through its ability to deform elastically under stress.
Solution Approach 2:
The patent creates a composite structure combining rigid substrates for structural support with a flexible substrate for stress accommodation. This composite material approach leverages the advantages of both rigid and flexible materials, maintaining mechanical strength while preventing warpage and solder non-bonding through the flexible component's stress-absorbing properties.
4Quantity of substance
If signal transmission paths are extended across large substrate areas to accommodate more components, then component capacity is improved, but signal transmission quality deteriorates
Solution Approach 1:
By arranging components and signal paths across vertical layers rather than extending them horizontally across large single-plane areas, the patent reduces signal transmission distances. The stacked substrate configuration allows signals to travel shorter paths through vertical interconnections, maintaining signal quality while accommodating increased component capacity through three-dimensional spatial utilization.
Data Source
AI summary
A component mounting board includes first and second substrates, a connection substrate, an interposer, and an electronic component. The first substrate has first and second surfaces opposing each other, a first side surface between the first and second surfaces, and a first signal pattern. The second substrate is disposed on the first substrate, has third and fourth surfaces opposing each other and a second side surface between the third and fourth surfaces, and includes a second signal pattern. The connection substrate is bent to connect the first and second side surfaces, and the interposer is disposed between the first and third surfaces and electrically connects the first and second signal patterns. The electronic component is mounted on at least one of the first to fourth surfaces.