Flexible Interposer With Integrated Components and Thermal Management
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Solution Overview
Problem
Current interposers, especially organic ones, lack the ability to integrate passive and active components, leading to increased manufacturing costs and system complexity, while silicon interposers are expensive and inflexible for modern electronic devices with shrinking sizes and increased functionalities.
Innovation Solution
A flexible interposer subassembly with integrated active and passive electronic components, thermal management layers, and patterned contact layers, allowing for finer line pitches and reduced assembly costs, and enabling optimal component positioning and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If silicon interposers are used, then manufacturing precision and reliability are improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent changes the material parameter from silicon to organic polymer, enabling finer design rules and lower manufacturing costs while maintaining interposer functionality. The organic material allows for reduced line widths and spaces in contact patterning without requiring complex silicon fabrication processes.
Solution Approach 2:
The patent employs organic interposer materials that are cost-effective alternatives to expensive silicon substrates. The organic interposer provides necessary interconnection functionality at lower manufacturing cost, eliminating the need for high-cost silicon fabrication infrastructure.
2Ease of manufacture
If organic interposers are used, then manufacturing cost is reduced, but functionality is limited to pure interconnects
Solution Approach 1:
The patent makes the organic interposer multi-functional by integrating passive components (capacitors, inductors, resistors) directly into the interposer structure. This allows the same organic substrate to serve both as an interconnection medium and as a host for passive electronic components, eliminating the need for separate component packages.
Solution Approach 2:
The patent merges the interposer function with passive component integration into a single organic substrate. Previously separate functions (interconnection and passive component hosting) are combined in one structure, reducing overall system complexity and manufacturing steps.
3Ease of manufacture
If conventional PCB substrates are used, then ease of manufacture is improved, but design rule resolution is insufficient
Solution Approach 1:
The patent changes the substrate material from conventional PCB to organic interposer material, enabling finer design rules with reduced line widths and spaces. This material parameter change allows for higher density interconnections while maintaining manufacturing feasibility through standard organic substrate fabrication processes.
Data Source
AI summary
An interposer subassembly that is suitable for an electronic system having at least one integrated circuit (1C) component. The interposer subassembly includes a flexible base layer, having a first surface and an opposing second surface, at least one active electronic circuit component, operatively integrated within the flexible base layer, and at least one first patterned contact layer, provided on any one of the first surface and the second surface of the flexible base layer and which is configured to operably interface with the at least one active electronic circuit component and the at least one 1C component.