Flexible Electronic Layout With Segmented Islands for Bend Reliability

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Solution Overview

Problem

Flexible electronic devices experience disconnections at portions with maximum stress when stretched or bent, despite using meander wiring structures for scanning and signal lines.

Innovation Solution

The device incorporates a structure where element areas are connected by wire bonding in specific directions, with organic insulating films having lower Young's modulus than the base structure, and is covered by additional organic and inorganic insulating films to mitigate stress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If scanning lines and signal lines are made in meander wiring structure, then adaptability to stretching and bending is improved, but disconnection occurs at portions with maximum stress

Engineering Contradiction:
Improveadaptability to stretching and bendingVSAvoidconnection reliability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The device is divided into multiple element areas that are isolated from each other by spaces, with wirings formed only within each element area. This segmentation prevents stress from propagating across the entire device, reducing the risk of disconnection at stress concentration points while maintaining flexibility through the meander structure within each segment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the device are given different properties: element areas contain functional components and wirings, while spaces between element areas act as stress relief zones. The insulating films are selectively formed in different layers to provide local mechanical support and stress distribution, creating areas of varying rigidity and flexibility to manage stress locally.

Inventive Principle:
Principle #3Local quality

2Stability of the object's composition

If element areas are isolated by spaces, then stress distribution is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvestress distributionVSAvoidstructure complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The spacing pattern is designed to extend in at least one direction to form a continuous insulating film between element areas. This dimensional approach to spacing simplifies the manufacturing process by reducing the number of discrete spacing structures needed, while still achieving effective stress distribution and isolation between element areas.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the adaptability of flexible electronic devices to stretching and bending, reducing stress concentrations and preventing disconnections, thereby improving reliability.

Implementation Method 1

each of young's modulus of the second organic insulating film and the third organic insulating film is smaller than young's modulus of the first organic insulating film

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS12362249B2Flexible electronic device
Publication Date: 2025.07.15 MAGNOLIA WHITE CORP
  • US12362249B2 patent drawing
  • US12362249B2 patent drawing
  • US12362249B2 patent drawing

AI summary

Purpose is to realize a flexible electronic device of high reliability. The present invention takes a following structure to realize the purpose. An electronic device including: a plurality of element areas, famed from a first organic insulating film, and formed in island shape arranged in a first direction with a first space and arranged in a second direction with a second space, in which an element, a first wiring extending in the first direction and a second wiring extending in the second direction are formed in each of the plurality of element areas, the first wirings famed in the plurality of the element areas are connected with each other by a first wire bonding in the first direction, and the second wirings famed in the plurality of the element areas are connected with each other by a second wire bonding in the second direction.