Flexible Isolation Material for OLED Encapsulation Crack Prevention
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Solution Overview
Problem
The existing OLED display panel manufacturing process results in a poor encapsulation effect due to the brittleness of the inorganic layer, which easily cracks during cutting and handling, and requires a mask with high manufacturing costs and wide borders, making it difficult to achieve narrow borders and increasing production costs.
Innovation Solution
A method involving the formation of an encapsulation structure layer with an inorganic layer, an organic layer, and another inorganic layer, where a cutting groove is filled with a flexible isolation material, allowing the panel to be cut without a mask, thus avoiding cracks and reducing manufacturing costs by eliminating the need for a mask and margin areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an inorganic layer is used in the encapsulation structure, then the encapsulation effect is improved, but the layer easily cracks during cutting and handling due to brittleness
Solution Approach 1:
The patent applies composite materials by combining the inorganic encapsulation layer with a flexible isolation material (such as polyimide or acrylic). The inorganic layer provides superior encapsulation and barrier properties, while the flexible isolation material provides crack resistance and flexibility. This composite structure allows the encapsulation layer to maintain its protective function while avoiding the brittleness problem of pure inorganic materials.
Solution Approach 2:
The flexible isolation material acts as an intermediary between the brittle inorganic encapsulation layer and the external environment. It serves as a buffer that absorbs mechanical stress and prevents direct transmission of cutting forces to the inorganic layer, thereby preventing cracks while maintaining the encapsulation integrity.
2Strength
If a mask is used during cutting, then the encapsulation layer is protected from cracks, but the manufacturing cost increases and narrow borders cannot be achieved
Solution Approach 1:
The flexible isolation material enables the encapsulation structure to protect itself during cutting without requiring an external mask. The isolation material's flexibility allows it to accommodate cutting forces and prevent cracks inherently, eliminating the need for additional protective masks and reducing manufacturing complexity and costs.
Solution Approach 2:
The patent extracts and removes the mask from the manufacturing process by replacing it with the flexible isolation material integrated into the encapsulation structure. This eliminates the need for separate mask components and simplifies the manufacturing process while maintaining crack protection.
3Strength
If a mask is used during cutting, then the encapsulation layer is protected, but wide borders are required which prevents narrow border displays
Solution Approach 1:
The flexible isolation material functions as a thin, flexible protective layer that can be applied directly to the encapsulation structure without requiring wide border areas. Its flexibility allows it to provide crack protection while conforming to narrow border geometries, enabling the production of narrow border display panels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible isolation material prevents cracks in the encapsulation layer during cutting and handling, improving the encapsulation effect and enabling narrow border displays while reducing manufacturing costs by eliminating the need for a mask and margin areas.
Implementation Method 1
the isolation material having greater flexibility than the encapsulation film layer in contact with the isolation material
Data Source
AI summary
A display panel and manufacturing method thereof, and a display device are provided. The method includes: forming an encapsulation structure layer on a display motherboard to obtain a panel motherboard, the encapsulation structure layer comprising at least one encapsulation film layer, and the at least one encapsulation film layer overlying a surface of the display motherboard; forming a cutting groove on the encapsulation structure layer along a cutting line of the panel motherboard; filling the cutting groove with an isolation material, the isolation material having greater flexibility than the encapsulation film layer in contact with the isolation material; and cutting the panel motherboard from the isolation material along the cutting line to obtain the display panel. The display panel helps improve the encapsulation effect of the encapsulation structure.


