Flexible LED Filament Substrate for 360° Light and Heat Resistance
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Solution Overview
Problem
Current LED filament substrates face limitations in achieving 360° omnidirectional illumination due to poor heat resistance, mechanical strength, and limited flexibility, which restricts their ability to provide uniform light emission and efficient thermal management.
Innovation Solution
An organosilicon-modified polyimide resin composition is used for the filament substrate, incorporating a light conversion layer with a top and base layer coated on electrodes, featuring fluorescent powders and heat dispersing particles, which enhances thermal conductivity, mechanical strength, and flexibility, allowing for 360° illumination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If silicone resin is used as the substrate material to eliminate glass or sapphire and achieve 360° light emission, then the cost is reduced and emission uniformity is improved, but the heat resistance becomes poor
Solution Approach 1:
The patent uses a composite material consisting of silicone resin as the base material combined with heat-resistant filler particles (such as alumina, silica, or boron nitride). This composite structure maintains the flexibility, transparency, and molding ease of silicone resin while the heat-resistant filler particles provide thermal stability and resistance to high temperatures, thereby resolving the contradiction between ease of manufacture and heat resistance.
2Temperature
If conventional transparent substrates like glass or sapphire are used to avoid blue light loss, then heat resistance is improved, but the substrate is hard and cannot be bent resulting in narrow illuminating angle
Solution Approach 1:
The patent employs a flexible silicone resin substrate that can be bent and shaped into various configurations, enabling the LED light source to emit light in multiple directions including 360° omnidirectional illumination. The silicone resin maintains sufficient mechanical strength while providing the flexibility needed to wrap around or conform to different shapes, thereby achieving wide-angle illumination that rigid substrates cannot provide.
3Adaptability or versatility
If the substrate is made from silicone resin to achieve flexibility and 360° light emission, then illuminating angle is improved, but mechanical strength becomes insufficient
Solution Approach 1:
The patent reinforces the silicone resin substrate by incorporating heat-resistant filler particles (alumina, silica, boron nitride) that serve dual purposes: improving mechanical strength and providing heat dissipation. The filler particles create a reinforced composite structure that maintains the flexibility and bendability of silicone resin while significantly enhancing its mechanical strength and structural integrity.
4Adaptability or versatility
If the substrate is made from silicone resin to achieve flexibility, then adaptability is improved, but thermal conductivity becomes poor
Solution Approach 1:
The patent addresses the poor thermal conductivity of silicone resin by incorporating thermally conductive filler particles such as alumina, silica, or boron nitride into the silicone matrix. These filler particles create thermal conduction pathways within the flexible silicone substrate, enabling effective heat dissipation while preserving the material's flexibility and ability to conform to various shapes for 360° light emission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat resistance, mechanical strength, and flexibility, enabling uniform light emission and efficient thermal management, thus overcoming the limitations of existing substrates.
Implementation Method 1
an organosilicon-modified polyimide resin composition... to enhance heat resistance, mechanical strength, and thermal conductivity
Implementation Method 2
a light conversion layer with a top and base layer coated on electrodes, featuring fluorescent powders
Data Source
AI summary
The present disclosure discloses an LED filament, comprising a plurality of LED chips; at least two electrodes, each of the at least two electrodes is connected to at least one of the plurality of LED chips; and a light conversion layer comprising a top layer and a base layer, coated on at least two sides of the at least two electrodes, and a portion of the at least two electrodes is exposed by the light conversion layer, where the top layer and the base layer are located at two sides of the plurality of LED chips, respectively, wherein the base layer comprising an organosilicon-modified polyimide, a thermal curing agent and fluorescent powders. The present disclosure further discloses an LED light bulb. The base layer of the present disclosure has superior transmittance, heat resistance and mechanical strength, and is suitable for producing a flexible LED filament.