Flexible Substrate LED Wiring via Insulated Conductive Ink

The patent replaces the mechanical wire bonding system with a conductive ink printing system. The conductive ink is printed directly on the substrate to form wirings that connect pad electrodes, eliminating the need for physical wire bonding. This substitution of mechanical bonding with a printed conductive path resolves the contradiction by providing both ease of manufacture (through printing) and reliability (by eliminating fragile wire bonds susceptible to external stress).

The patent introduces an insulating film as an intermediary layer between the conductive ink wirings and the semiconductor layer. This insulating film prevents direct contact between the conductive ink and the semiconductor, avoiding potential degradation while maintaining electrical connectivity through the printed wirings. The intermediary layer enables the use of conductive ink without compromising device reliability.

The insulating film serves as a protective intermediary between the conductive ink wirings and the semiconductor components. By placing the insulating film between the conductive ink and the semiconductor layer, the patent prevents harmful interactions that would otherwise cause wiring breakage and resin degradation, thereby maintaining reliability while preserving the manufacturing advantages of conductive ink printing.

The patent applies an insulating film beforehand to protect the semiconductor layer and surrounding resin from the conductive ink. This preventive measure cushions against potential degradation effects before they can occur, ensuring long-term reliability while maintaining the ease of manufacture provided by conductive ink printing.