Flexible LED Lighting Device with Shape Retention Layer
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Solution Overview
Problem
Conventional surface lighting devices using LED packages are rigid and cannot conform to non-planar object surfaces, and while attempts with OLEDs and micro-LEDs face challenges like high cost and low luminous efficiency, there is a need for flexible LED lighting solutions that can be deformed and maintain shape effectively.
Innovation Solution
A flexible surface lighting device featuring micro-LED chips mounted on a substrate with a light-transmitting resin and wavelength-converting film, allowing deformation and maintaining shape through a shape retention layer and heat-dissipating parts, and a micro-LED display panel with a light-transmitting film that effectively removes air gaps between modules by forming air holes along gap lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional LED packages are used in surface lighting devices, then high luminous efficiency and long lifespan are achieved, but the rigidity of the circuit board limits the device to planar shapes only
Solution Approach 1:
The patent divides the rigid circuit board into multiple flexible circuit board segments that can be independently bent and arranged. Each segment contains LED modules that can conform to different surface shapes, allowing the overall lighting device to adapt to non-planar surfaces while maintaining structural integrity through the segmentation of rigid components into flexible modular units
Solution Approach 2:
The patent replaces the rigid circuit board with a flexible circuit board that has elastic properties, allowing it to be bent and deformed to match various surface contours. The flexible circuit board maintains electrical connectivity while providing the necessary flexibility to conform to curved or irregular surfaces, thus resolving the contradiction between structural rigidity and shape adaptability
2Adaptability or versatility
If OLEDs are used as light sources to achieve flexibility, then shape adaptability is improved, but high price and low luminous efficiency make commercialization difficult
Solution Approach 1:
The patent uses inexpensive LED chips mounted on flexible circuit boards instead of costly OLEDs. While individual LED components have shorter lifespans than OLEDs, the overall system achieves commercial viability through lower material costs and maintained luminous efficiency, trading long-term durability for immediate economic feasibility and energy efficiency
Solution Approach 2:
The patent changes the material parameters of the circuit board from rigid to flexible while maintaining LED as the light source. This parameter change in the substrate flexibility allows the system to achieve shape adaptability without switching to OLED technology, thereby preserving the superior luminous efficiency and cost-effectiveness of LED components
3Ease of manufacture
If micro-LED modules are arrayed in a matrix with gap lines, then manufacturing is simplified, but air remains in the gap lines causing defects in the display panel
Solution Approach 1:
The patent applies a light-transmitting film over the entire arrayed micro-LED modules before the air entrapment problem occurs during operation. This preliminary application of the film allows for subsequent removal of trapped air through the gap lines, ensuring that the display panel achieves defect-free operation while maintaining the manufacturing simplicity of the matrix array configuration
Solution Approach 2:
The gap lines between micro-LED modules serve as intermediary channels that allow air to escape from between the light-transmitting film and the module array. These gap lines act as mediators that resolve the conflict between maintaining simple matrix manufacturing and achieving reliable air-free operation, enabling both manufacturing ease and display quality
4Object-affected harmful factors
If a light-transmitting film is attached on micro-LED modules, then light diffusion prevention is achieved, but cutting the film along gap lines creates light leakage due to refractive index differences
Solution Approach 1:
The patent extracts or removes the light-transmitting film from the gap line areas where it would cause light leakage due to refractive index differences. By taking out the film selectively from these boundary regions while maintaining it over the active LED areas, the solution prevents diffuse reflection where needed while eliminating the harmful light leakage effect at the module boundaries
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables flexible LED lighting devices that can be curved and maintain uniform light emission, fabricated over large areas, and effectively removes air gaps in micro-LED display panels, suitable for various applications including design and indoor lighting.
Implementation Method 1
a flexible surface lighting device featuring micro-LED chips mounted on a substrate with a light-transmitting resin and wavelength-converting film
Implementation Method 2
allowing deformation and maintaining shape through a shape retention layer
Implementation Method 3
heat-dissipating parts
Implementation Method 4
effectively removes air gaps between modules by forming air holes along gap lines
Data Source
AI summary
A flexible surface lighting device is disclosed. The flexible surface lighting device includes: a flexible substrate including an upper insulating film, a lower insulating film, and a thin metal layer interposed between the upper and lower insulating films; a plurality of micro-LED chips two-dimensionally arrayed on the top surface of the flexible substrate; and a flexible light-transmitting resin part disposed on the top surface of the flexible substrate to cover the top and side surfaces of the micro-LED chips. The flexible substrate includes a white reflective layer in contact with the light-transmitting resin part on the upper insulating film.