Flexible LED Mirror Circuit Layout for Uniform Light Distribution
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Solution Overview
Problem
Conventional LED lighted mirrors suffer from poor light output, poor light distribution, and limited light quality flexibility due to the limited number of LED packages and their placement, leading to pixilation and inadequate illumination.
Innovation Solution
A lighted mirror apparatus employing a flexible circuit board with a plurality of LED packages positioned outside the reflective module surface periphery, allowing for increased LED package count and varying optical qualities, along with driver circuitry for controlling brightness, color temperature, and CRI, and a reflective module design that includes a frosted area and spacers to prevent edge lighting and enhance thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional LED packages are mounted on rigid circuit boards within the reflective module, then structural support is provided, but light output and light distribution are poor due to limited LED package count and placement restrictions
Solution Approach 1:
The patent replaces rigid circuit boards with flexible circuit boards that can be conformally mounted within the reflective module. This flexibility allows the LED packages to be positioned optimally for light distribution while maintaining structural support, thereby improving light output without adding structural complexity
Solution Approach 2:
The patent transitions from planar mounting of LED packages to three-dimensional positioning enabled by flexible circuit boards. This allows LED packages to be arranged in multiple layers and angles, maximizing light output and distribution while utilizing the reflective module's internal volume efficiently
2Illumination intensity
If the number of LED packages is increased to improve light output, then illumination intensity improves, but thermal management becomes more difficult due to increased heat generation
Solution Approach 1:
The patent introduces flexible circuit boards as thermal intermediaries between the LED packages and the reflective module housing. These flexible circuits are designed with thermal conductivity to efficiently conduct heat away from the LED packages, enabling increased LED density without thermal overload
Solution Approach 2:
The patent extracts thermal management functionality from the structural components and integrates it into the flexible circuit board system. This separation allows the structural support function to remain simple while the thermal management function is optimized independently to handle increased heat loads
3Illumination intensity
If LED packages are positioned within the reflective module surface periphery, then structural integration is simplified, but light distribution is poor causing pixilation and inadequate illumination
Solution Approach 1:
The flexible circuit board allows LED packages to be positioned in non-planar configurations and optimally distributed across the reflective module surface. This flexibility eliminates pixilation by ensuring uniform light distribution while keeping the positioning system simple and integrated
4Adaptability or versatility
If conventional rigid circuit boards are used for mounting LED packages, then manufacturing is simpler, but light quality flexibility is limited due to fixed positioning
Solution Approach 1:
The patent introduces flexibility to the circuit board, allowing the LED packages to be dynamically positioned in optimal locations for different light quality requirements. This enables adjustment of LED patterns and distributions while maintaining ease of manufacture through standardized flexible circuit board fabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved light output, distribution, and quality options by increasing the number of LED packages, allowing for customizable color temperature and CRI without diminishing lumen output, while also enhancing thermal management through the use of a flexible circuit board.
Implementation Method 1
Light emitting devices may comprise light emitting diodes as the light source. Light emitting diodes (also referred to herein as LEDs) are semiconductor devices that emit light when an electric current is passed through them.
Implementation Method 2
enhancing thermal management through the use of a flexible circuit board
Data Source
AI summary
A mirror apparatus includes a reflective module defining an interior and an exterior, at least a first reflection surface provided in the reflective module, a plurality of LED packages provided on a flexible circuit board disposed within the reflective module interior along the periphery of the first reflection surface, a base configured to house power components, and a coupling arm coupled to the base and to the reflective module to support such module.