Flexible LED Module for High-Density Attachment to Complex Shapes
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Solution Overview
Problem
The surface mounting type LED package is too small, making it difficult to attach to lighting devices of various shapes in high density.
Innovation Solution
An LED module comprising a flexible wiring substrate with a plurality of surface mounting type LED packages, where the flexible wiring substrate has power supply terminals and patterned wiring, allowing for easy attachment and high-density arrangement by cutting the LED module wafer to achieve a desired shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If surface mounting type LED packages are used, then the LED package size is reduced, but the attachment density to lighting devices of various shapes becomes difficult to achieve in high density
Solution Approach 1:
The invention divides the LED package into two independent components: a small surface mounting type LED package (containing LED chip and mounting substrate) and a flexible wiring substrate. This segmentation allows the LED package to maintain its small size while the flexible wiring substrate provides the necessary electrical connections and adaptability for high-density attachment to various shaped lighting devices.
Solution Approach 2:
The invention transitions from rigid planar wiring substrates to flexible wiring substrates that can be bent and conform to three-dimensional surfaces. This dimensional flexibility enables high-density attachment to lighting devices of various shapes, resolving the contradiction between small LED package size and achievable attachment density on complex geometries.
2Adaptability or versatility
If the LED module is made flexible to attach to various shapes, then the adaptability to lighting device shapes is improved, but the manufacturing complexity increases
Solution Approach 1:
The flexible wiring substrate is pre-formed with conductive patterns and connection structures before the LED packages are mounted. This preliminary preparation simplifies the subsequent assembly process, as the electrical connections are already in place and the substrate is ready to be attached to the target surface, reducing overall manufacturing complexity despite the flexibility requirement.
Solution Approach 2:
The invention employs a flexible wiring substrate made from thin film materials that can be easily manipulated and attached to various surfaces. This flexible substrate structure provides adaptability to different lighting device shapes while maintaining relatively simple manufacturing processes through standard flexible PCB techniques and simplified assembly methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the attachment of LED modules to lighting devices of complex shapes in high density, ensuring uniform light emission and efficient heat management through thermal vias and heat radiation layers.
Implementation Method 1
Each the mounting substrate is formed at its rear surface with an external connection electrode. Each the mounting substrate is mounted on the flexible wiring substrate such that the first connection electrode and the second connection electrode are electrically connected to the first electrode pad and the second electrode pad, respectively.
Implementation Method 2
The LED module comprises a flexible wiring substrate and a plurality of surface mounting type LED packages... efficient heat management through thermal vias and heat radiation layers.
Data Source
AI summary
The LED module comprises a flexible wiring substrate and surface mounting type LED packages. The flexible wiring substrate is formed at its surface with power supply terminals which comprises a first electrode pad and a second electrode pad, and is formed with a patterned wiring being electrically connected to the patterned wiring. The surface mounting type LED package comprises an LED chip and a mounting substrate. The mounting substrate is formed at its front surface with a recess, and its rear surface with a first connection electrode and the second connection electrode which are electrically connected to the first electrode pad and the second electrode pad, respectively when the mounting substrate is mounted on the flexible wiring substrate. The LED chip is disposed within the recess so as to receive the electrical current through the outside connection electrode and the power supply terminal.