Same-Side Contact Flexible LED for High-Yield Manufacturing
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Solution Overview
Problem
Conventional LED devices are complex to manufacture, resulting in lower yields and are typically rigid and thick, limiting their use in space-sensitive applications and reducing their ability to produce sufficient light due to size constraints.
Innovation Solution
A flexible lighting device with a thin, ultrathin light-emitting diode (LED) structure featuring a flexible substrate, conductive elements, and a phosphor layer to emit light across a wide range of wavelengths, allowing for easier manufacturing and increased light output while maintaining a thin and flexible form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional LED configuration with anode on one side and cathode on the other is used, then the LED structure is simple, but the manufacturing process becomes complex and manufacturing yield decreases
Solution Approach 1:
The patent inverts the conventional LED configuration by placing both the anode and cathode on the same side of the LED chip. This inversion allows for simplified manufacturing processes and improved manufacturing yield while maintaining the basic LED functional structure.
Solution Approach 2:
The patent transitions from a three-dimensional configuration where anode and cathode are on opposite sides to a two-dimensional configuration where both contacts are on the same plane. This dimensional change simplifies the bonding process and improves manufacturing efficiency.
2Adaptability or versatility
If conventional rigid LED devices are used, then the device structure is stable, but the device thickness increases and flexibility is lost
Solution Approach 1:
The patent replaces rigid substrates with flexible substrates, enabling the LED device to be thin and adaptable to various surfaces while maintaining structural integrity. This allows the device to conform to curved or irregular surfaces.
Solution Approach 2:
The patent transitions from a static rigid structure to a dynamic flexible structure that can adapt its shape and form factor. The flexible substrate and bonding methods enable the device to be bent, folded, or conformed without compromising functionality.
3Length of stationary object
If LED size is reduced to achieve thin device profile, then the device thickness decreases, but the light output capacity is limited
Solution Approach 1:
The patent utilizes the same-side contact configuration to optimize the use of available space, allowing for larger effective LED area within a thin profile. The two-dimensional layout of contacts enables more efficient light extraction paths.
Solution Approach 2:
The patent employs multiple smaller LED chips or segmented LED structures that can be arranged in patterns to achieve both thinness and high light output. The segmented approach allows for optimized light distribution while maintaining a thin overall device thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible LED device offers improved manufacturing efficiency, increased light output, and enhanced versatility by allowing for larger lighting elements in a thin, flexible form, addressing the limitations of conventional LED devices in terms of size and rigidity.
Implementation Method 1
a light-emitting diode having a positive contact and a negative contact, the positive and negative contacts both being on a first side of the light-emitting diode, the light-emitting diode being configured to emit light having a selected wavelength between 10 nm and 100,000 nm
Implementation Method 2
The flexible lighting element may further comprise a phosphor layer located between the second surface of the light-emitting diode and the second flexible substrate, wherein the light-emitting diode emits light having a wavelength between 260 nm and 505 nm
Implementation Method 3
The flexible lighting element may further comprise a first heat sink attached to the first flexible substrate, wherein the first heat sink comprises either a flexible metal layer or a flexible ceramic thin film layer
Data Source
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AI summary
A flexible lighting element, is provided comprising: a first flexible substrate (510, 1110); a first conductive element (130) located on the first flexible substrate (510, 1110); a second conductive element (140) located on the first flexible substrate (510, 1110); a light-emitting diode (210) having a positive contact (230) and a negative contact (240), the positive and negative contacts (230, 240) both being on a first side of the first light-emitting diode (210), the light-emitting diode (210) being configured to emit light having a selected wavelength between 10 nm and 100,000 nm; a first conductive connector (235) located between the first conductive element (130) and the positive contact (230), the first conductive connector (235) being configured to electrically connect the first conductive element (130) to the positive contact (230); a second conductive connector (245) located between the second conductive element (140) and the negative contact (240), the second conductive connector (245) being configured to electrically connect the second conductive element (140) to the negative contact (240); a second flexible substrate (530) located adjacent to a second surface of the light-emitting diode (210), the second surface of the light-emitting diode (210) being on an opposite side of the light-emitting diode (210) from the first surface of the first light-emitting diode (210); and an affixing layer (540) located between the first flexible substrate (510, 1110) and the second flexible substrate (530), the affixing layer (540) being configured to affix the second flexible substrate (530) to the first flexible substrate (510, 1110), wherein the second flexible substrate (530) is substantially transparent to the selected wavelength of light, and the first and second conductive connectors (235, 245) each comprise either an epoxy dot or an applied metal pad.