Flexible LED Light Source with Separation Ridge
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Solution Overview
Problem
Existing LED-based light sources face challenges in replicating the form factor and intensity of fluorescent tubes, requiring multiple LEDs and large printed circuit boards, which increases costs and design complexity due to heat dissipation and inventory management issues.
Innovation Solution
A flexible printed circuit board with a heat-conducting layer, insulating layer, and circuit layer, featuring separation ridges to protect LEDs, allows for modular LED grouping and roll-to-roll processing, enabling efficient construction of distributed light sources that can be cut to various sizes and configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large area printed circuit board is used to provide sufficient heat dissipation surface, then heat dissipation is improved, but manufacturing cost and device complexity increase due to expensive pick and place equipment requirements
Solution Approach 1:
The invention divides the light source into multiple modular segments that can be independently manufactured on smaller, standard-sized printed circuit boards. Each module contains a manageable number of LEDs and can be produced using conventional pick and place equipment, avoiding the need for expensive large-area board manufacturing equipment while still achieving adequate heat dissipation through modular scaling.
Solution Approach 2:
Multiple LED dies are mounted in a nested arrangement on the printed circuit board, with LEDs positioned to optimize heat transfer to the board's heat-dissipating structures. The modular design allows these nested arrangements to be replicated across multiple identical modules, simplifying manufacturing while maintaining effective heat dissipation through standardized thermal pathways.
2Illumination intensity
If multiple LED-based tubes are used to replace fluorescent tubes, then light output is sufficient, but the number of components and assembly complexity increase
Solution Approach 1:
Multiple LED dies are combined onto a single printed circuit board within each module, integrating what would otherwise require multiple separate tube components. The modular design allows these combined modules to be assembled in series or parallel configurations to achieve the desired light output, reducing the total component count and simplifying assembly compared to using multiple discrete LED tubes.
Solution Approach 2:
The standardized modular design creates universal building blocks that can be configured to replace various fluorescent tube sizes and configurations. A single module type can be used in different quantities and arrangements to achieve different light outputs, eliminating the need to inventory multiple specialized tube types while maintaining flexibility in lighting design.
3Adaptability or versatility
If fluorescent tube form factor is maintained for LED replacement, then compatibility is improved, but heat dissipation capability deteriorates due to limited space
Solution Approach 1:
The invention uses flexible printed circuit boards that can be bent and shaped to conform to the curved surface of the fluorescent tube envelope. This dynamic configuration allows the rigid LED components and their heat-dissipating structures to be positioned optimally for heat transfer while maintaining the external form factor compatibility with existing fluorescent tube fixtures.
Solution Approach 2:
Heat dissipation is achieved by extending thermal pathways in three dimensions within the constrained tube form factor. Multiple heat-dissipating structures are positioned at different depths and angles within the tube envelope, creating立体 thermal management that maximizes heat transfer surface area without increasing the external dimensions, thus maintaining fixture compatibility while improving heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of components needed, simplifies manufacturing, and allows for cost-effective production of LED-based light sources with improved heat management, enabling efficient and flexible LED-based light fixtures that match the performance of fluorescent systems.
Implementation Method 1
The flexible printed circuit board has a bottom heat-conducting layer
Data Source
AI summary
A precursor structure for fabricating light sources, the light sources fabricated therefrom, and the method of fabricating the precursor structure are disclosed. A precursor substrate includes a flexible printed circuit board on which dies are bonded and a separation ridge. The flexible printed circuit board has a bottom heat-conducting layer, an insulating layer, and a circuit layer. The insulating layer and the circuit layer include a plurality of openings that expose the top surface of the heat-conducting layer. The separation ridge extends above the circuit layer and the dies and is configured to prevent contact with the dies and any structures constructed above the dies when the precursor substrate is in contact with a surface positioned over the die and in contact with the separation ridge. The structure is well suited for roll-to-roll processing equipment.