Flexible LED Light-Emitting Device with Stacked Optical Layers

The patent transitions from conventional planar LED structures to a three-dimensional stacked configuration where multiple LED chips are vertically arranged on a substrate. This vertical stacking enables the light-emitting area to extend in the thickness direction, effectively increasing the light field without requiring lateral expansion, while the overall device thickness is controlled through the layered structure design.

The patent implements a nested structure where multiple LED chips are stacked within a compact vertical space on the substrate. Each LED chip unit is nested above the previous one, with connection structures integrated within the stacked configuration. This nesting approach maximizes the light-emitting volume within a constrained thickness, achieving increased illumination intensity without proportional increase in device thickness.

The patent combines multiple LED chips, connection structures, and support elements into an integrated stacked assembly on a single substrate. Rather than treating each LED unit as a separate component requiring individual mounting and wiring, the design merges these elements into a unified multi-layer structure where electrical connections are established through vertical interconnections within the stack, reducing overall assembly complexity.

The patent resolves complexity by moving from lateral arrangement of LED units to vertical stacking in the thickness direction. This dimensional transition allows multiple LED units to be accommodated within a compact footprint on the substrate while simplifying interconnections through vertical pathways. The stacked configuration reduces the need for complex lateral routing and simplifies the overall device architecture compared to planar expansions.