Flexible LED Substrate Thermal Management
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Solution Overview
Problem
Current LED lighting systems for automotive backlights are low power, have limited heat dissipation, operate at lower voltages, and have shorter lifespans compared to general lighting fixtures, necessitating higher power LED systems with improved heat dissipation and longer lifespan for safety and design flexibility.
Innovation Solution
A flexible layered structure comprising a top conductive layer, a dielectric middle layer, and a bottom heat sink layer, with defined positions for LED alignment and notches for bending, allowing the structure to be bent and twisted while maintaining its shape, and featuring a heat sink adhesive layer for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a multi-layered structure is used for high power LED systems, then heat dissipation capability is improved, but the structure cannot maintain the bend or position when bent or twisted
Solution Approach 1:
The patent applies flexible substrate materials including polyimide films and thin metal layers (copper, aluminum) that can be bent and twisted while maintaining structural integrity. These thin flexible layers replace rigid multi-layered structures, enabling the LED assembly to conform to curved surfaces while preserving heat dissipation pathways through thermally conductive adhesive layers and flexible heat sink structures.
Solution Approach 2:
The patent employs composite material structures combining flexible substrates with thermally conductive materials. The composite includes flexible polyimide layers, thin metal conductive layers, and thermally conductive adhesive compositions that provide both mechanical flexibility and thermal management capabilities, resolving the contradiction between flexibility and heat dissipation.
2Use of energy by moving object
If higher power LED systems are implemented, then light output and lifespan are improved, but heat dissipation requirements increase significantly
Solution Approach 1:
The patent introduces thermally conductive adhesive layers as intermediary materials between the LED components and heat sink structures. These adhesive layers serve as thermal pathways that efficiently conduct heat away from high-power LED junctions, enabling higher power operation without excessive temperature buildup. The adhesive compositions include thermally conductive fillers that enhance heat transfer while maintaining electrical insulation.
3Stability of the object's composition
If rigid multi-layered structures are used for LED assemblies, then structural stability is maintained, but design freedom and flexibility are limited
Solution Approach 1:
The patent replaces rigid multi-layered structures with flexible thin-film constructions including polyimide substrates and thin metal layers. These flexible films allow the LED assembly to be bent, twisted, and shaped into various configurations while maintaining structural stability through appropriate layer thicknesses and material selections, thereby enabling design freedom for complex lighting applications.
4Adaptability or versatility
If thin flexible layers are used for the structure, then flexibility and bendability are improved, but electrical insulation and thermal management become more challenging
Solution Approach 1:
The patent employs composite material structures where thin flexible polyimide layers are combined with thermally conductive adhesive layers and flexible heat sink structures. The composite design ensures adequate electrical insulation through the polyimide's inherent dielectric properties while maintaining thermal management effectiveness through thermally conductive pathways in the adhesive and heat sink layers, thus preserving reliability despite reduced thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible layered structure enables high power LED systems with improved heat dissipation, longer lifespan, and design flexibility, allowing for efficient thermal management and increased light output while maintaining electrical integrity.
Implementation Method 1
a flexible bottom heat sink layer having a thickness of at least 10, 20, 25, 30, 40, 50, 75 or 100 microns... At least a portion of the flexible bottom heat sink layer is a metal which can be the same or different from the metal of the flexible top conductive layer
Implementation Method 2
a flexible dielectric middle layer comprising a polymer... provides electrical insulation between the flexible top conductive layer and the flexible bottom heat sink layer
Data Source
AI summary
A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.