Flexible LED Substrate Thermal Management for Automotive Backlights

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Solution Overview

Problem

Current LED lighting systems for automotive backlights are limited by low power, poor heat dissipation, and short lifespan, requiring higher power and improved heat management for extended usage and safety recognition.

Innovation Solution

A flexible layered structure comprising a conductive top layer, a dielectric middle layer, and a heat sink bottom layer, with defined positions for LED alignment and notches for bending, allowing for high power LED systems that can be bent and twisted to conform to various shapes while maintaining thermal conductivity and electrical insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional rigid LED structures are used, then structural stability is maintained, but design flexibility and ability to conform to complex shapes is lost

Engineering Contradiction:

Improvedesign flexibilityVSAvoidstructural stability

Core Design Contradiction:

Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent employs flexible printed circuit boards (PCBs) as the structural substrate, replacing traditional rigid boards. This flexible PCB allows the LED assembly to be bent and twisted to conform to complex three-dimensional shapes while maintaining electrical connectivity and structural integrity, directly resolving the contradiction between design flexibility and structural stability

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The invention uses composite material structures including flexible PCBs combined with LED arrays, heat sink integrations, and protective coatings. These composite structures provide both the flexibility needed for complex shaping and the structural stability required for reliable operation, resolving the contradiction through material composition

Inventive Principle:

Principle #40Composite materials

2Power

If higher power LEDs are used, then light output and efficiency are improved, but heat dissipation requirements increase

Engineering Contradiction:

Improvepower outputVSAvoidheat dissipation

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The patent introduces thermal interface materials and heat sink structures as intermediary components between the high-power LED chips and the external environment. These intermediaries facilitate efficient heat transfer from the LED junctions through the flexible PCB to dedicated heat dissipation pathways, enabling high power operation while managing thermal loads

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The design incorporates thermal management structures that account for thermal expansion and contraction cycles. Heat sinks and mounting structures are designed to accommodate thermal dimensional changes, allowing sustained high-power operation without compromising structural integrity or LED performance

Inventive Principle:

Principle #37Thermal expansion

3Duration of action of stationary object

If extended usage life is achieved, then reliability is improved, but heat management requirements become more stringent

Engineering Contradiction:

Improveusage lifeVSAvoidheat management

Core Design Contradiction:

Duration of action of stationary objectVSTemperature

Solution Approach 1:

The patent implements continuous heat dissipation pathways that operate throughout the entire usage life of the LED system. Thermal management structures are designed to maintain consistent heat flow from the LED junctions throughout operation, preventing thermal accumulation that would otherwise limit usage duration and reliability

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The flexible layered structure enables high power LED systems with enhanced heat dissipation and extended lifespan, capable of being bent and twisted to fit complex shapes, improving light quality and design flexibility for automotive and other lighting applications.

Implementation Method 1

a flexible bottom heat sink layer having a thickness of at least 10, 20, 25, 30, 40, 50, 75 or 100 microns... At least a portion of the flexible bottom heat sink layer is a metal

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a flexible dielectric middle layer comprising a polymer... that provides electrical insulation between the flexible top conductive layer and the flexible bottom heat sink layer

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS8629464B2Three dimensional light emitting diode systems, and compositions and methods relating thereto

Publication Date: 2014.01.14 DUPONT ELECTRONICS INC

AI summary

A flexible layered structure is disclosed having a flexible top conductive layer, a flexible bottom heat sink layer and a flexible dielectric middle layer. The combination has a longitudinal axis and a plurality of defined positions spaced along the longitudinal axis. The defined positions can be used for aligning a circuit and/or for the placement of LED lights. The flexible layered structure can be easily bent to form a LED substrate for shining light in more than one direction while efficiently removing heat arising from the LEDs.