Flexible LED Substrate with Wraparound Electrodes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional surface mount-type LEDs face issues with substrate fracture and deformation due to mounting load, and separation of the sealing resin body from the substrate when the substrate thickness is reduced.
Innovation Solution
A sheet-like flexible substrate with electrode patterns covering entire upper and lower surfaces, including spaces between them, to reinforce the substrate and prevent deformation, with the sealing resin body inserted into a motherboard hole, allowing effective heat dissipation and reinforcement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the substrate thickness is reduced to satisfy miniaturization requirements, then the overall LED size and thickness are reduced, but the substrate becomes prone to fracture and deformation under mounting load
Solution Approach 1:
The patent applies composite material structure by forming a resin layer that integrates the sealing resin body and reinforcing resin, creating a composite structure that combines the light-transmitting properties of the sealing resin with the mechanical reinforcement of additional resin material. This composite approach allows the substrate to maintain reduced thickness while gaining enhanced strength and deformation resistance through the integrated reinforcing layer.
Solution Approach 2:
The patent extends the sealing resin body in the thickness direction beyond the substrate boundaries, creating a reinforcing structure that protrudes from the substrate surfaces. This dimensional extension transforms the two-dimensional sealing function into a three-dimensional reinforcing structure that provides mechanical support and prevents substrate deformation without increasing the planar footprint of the LED.
2Length of moving object
If the substrate thickness is reduced, then the LED overall thickness is reduced, but the substrate is likely to be fractured or deformed due to mounting load
Solution Approach 1:
The patent implements beforehand cushioning by pre-forming the sealing resin body to extend beyond the substrate boundaries in the thickness direction, creating a reinforcing structure before the mounting process. This pre-formed reinforcing resin layer acts as a cushioning element that absorbs and distributes mounting loads, preventing fracture and deformation of the thin substrate during the soldering and assembly processes.
Solution Approach 2:
The reinforcing resin layer serves as an intermediary element between the thin substrate and the external mounting environment. This intermediate layer transfers and distributes mechanical stresses from the mounting process, protecting the fragile thin substrate while maintaining the overall structural integrity and reliability of the LED assembly.
3Length of moving object
If the substrate thickness is reduced, then the LED is thinner, but separation of the sealing resin body from the substrate is likely to occur due to bending deformation
Solution Approach 1:
The patent merges the sealing resin body and the reinforcing structure into a single integrated resin layer that extends continuously from within to beyond the substrate boundaries. This merging eliminates the interface between separate sealing and reinforcing components, preventing separation and maintaining compositional stability. The unified resin structure ensures that the sealing function and mechanical reinforcement work together without delamination or detachment.
Data Source
AI summary
A light-emitting diode is provided which includes: a sheet-like substrate; a pair of electrode patterns formed to wrap round and cover substantially entire upper and lower surfaces of the substrate, said pair of electrode patterns comprising an upper electrode portion, a lower electrode portion and a side electrode portion; a light-emitting element mounted on at least one of the electrode patterns; and a translucent sealing resin body that seals the light-emitting element. The pair of electrode patterns are separated by spaces formed therebetween, and substantially the entire surfaces of the substrate, except the spaces, are covered with the electrode patterns.