Flexible LED Arrangement with Thermally Conductive Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High power light emitting diodes with significant thermal emission require efficient heat management and easy mounting solutions for flexible integration into various applications, such as motor vehicle lamps, which existing technologies do not adequately address.
Innovation Solution
A light emitting diode arrangement featuring a flexible circuit board with a thermally conductive layer and adhesive-containing layer, where high power light emitting diodes are soldered for both electrical and mechanical fixation, allowing for effective heat dissipation and easy mounting onto heat sinks, enabling adaptation to different forms and luminosity requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If high power light emitting diodes are mounted onto a flexible circuit board, then ease of mounting and adaptability to different forms is improved, but thermal management becomes more challenging
Solution Approach 1:
The patent combines multiple functions into the flexible circuit board: it serves as both the mounting substrate and the thermal management system. The thermally conductive layer is integrated directly into the circuit board structure, merging mechanical support and heat dissipation functions into a single component, thereby improving ease of mounting while effectively managing thermal issues.
Solution Approach 2:
The flexible circuit board is designed to perform multiple functions simultaneously: electrical connection through conductor tracks, mechanical support through the carrier layer, and thermal management through the thermally conductive layer. This multi-functionality allows the same component to address both mounting ease and thermal management requirements.
2Loss of energy
If a thermally conductive layer is added to the flexible circuit board, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The thermally conductive layer is merged with the flexible circuit board structure rather than being a separate附加 component. This integration approach improves heat dissipation efficiency while minimizing the increase in device complexity by combining thermal management functionality into the existing circuit board architecture.
3Strength
If high power light emitting diodes are soldered onto the flexible circuit board, then mechanical fixation and electrical connection are improved, but thermal emission increases
Solution Approach 1:
The thermally conductive layer acts as an intermediary between the soldered high power light emitting diodes and the heat sink. It provides a dedicated thermal pathway that efficiently conducts heat away from the LED mounting area, thereby managing the thermal emission generated by the strong mechanical and electrical connection achieved through soldering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a reliable, efficient heat management system for high power light emitting diodes, ensuring effective thermal dissipation and easy mounting, thereby enhancing the flexibility and adaptability of the light emitting diode arrangement for various applications.
Implementation Method 1
the thermally conductive layer is in thermal contact with the high power light emitting diode. heat propagates firstly in the thermally conductive layer. Afterward, the heat is emitted to the surroundings over a large area and taken up for example by the flexible carrier layer
Implementation Method 2
the high power light emitting diode is soldered onto the flexible circuit board. By means of the soldering process the light emitting diode is both electrically contact-connected to the flexible circuit board and mechanically fixed on the circuit board
Data Source
AI summary
A light emitting diode arrangement, having at least one high power light emitting diode, the high power light emitting diode being mounted onto a flexible circuit board. A method is also disclosed for producing such a light emitting diode arrangement.